Siemens Aktiengesellschaft

Shell Oil Comapny

Osram Opto Semiconductors Gmbh

Epcos Ag

Siemens Nixdorf Informationssysteme Aktiengesellschaft

Saint-gobain Glass France

Heiner Bayer

Ernst Wipfelder

Barbara Lehner

Carsten Schuh

Wolfgang Pahl

Jens Dahl Jensen

Hellmut Freudenberg

Randolf Mock

Christoph Hamann

Günter Lugert

Michael Rogalli

Winfried Plundrich

Reiner Habrich

Axel Ganster

Walter Fischer

Hans Stelzl

Wolfgang Rogler

Jörg Zapf

Lothar Schoen

Helmut Markert

Axel Möhle

Volker Muhrer

Klaus H&ouml;hn

Wolfgang Roth

Martin Honsberg-Riedl

Ulrich Hartmann

Wilhelm Hekele

Bernhard Stapp

Oliver Hennig

Dieter Dlugosch

Ludwig Erd

Klaus Hoehn

Gregor Unger

Torsten Metzner

Gudrun Kühne

Hans-Peter Fritsch

Kurt Wohak

Hermann Calwer

Frank Dittrich

Oskar Wirbser

Oliver Henning

The invention relates to methods for manufacturing a rotor () for an electric machine (), having the following method steps: a) manufacturing a magnetic element () by bonding permanent magnets ('&#x2033;) by means of a first adhesive, each permanent magnet (&#x2032;&#x2033;) having a side with a magnetic North pole (N) and a side with a magnetic South pole (S), the permanent magnets (&#x2032;&#x2033;) being arranged during bonding such that the sides of the magnetic North poles (N) or the sides of the magnetic South poles (S) form a common underside (&#x2032;&#x2033;) of the magnetic elements (), the first adhesive having a hard consistency in the cured state; and b) bonding the underside of the magnetic element () to a yoke () by means of a second adhesive, the second adhesive being soft and elastic in the cured state. Furthermore, the invention relates to an associated rotor. The invention permits rational manufacture of a rotor having a permanent magnet for a machine, the permanent magnets being integrally fixed to the yoke of the rotor with high reliability.

Rotor and method for manufacturing a rotor of an electric machine

In a method for the production of a gradient encapsulation layeron a piezoelectric actuator, based on this gradient encapsulation layer, the piezoelectric actuatordoes notrequire an additional housing-like enveloping structure in order to be protected externally. The gradient encapsulation layeris produced by cold gas spraying of particles having different material properties.

Piezoelectric actuator with encapsulation layer having a thickness-varying property gradient

In a method for producing a multilayer encapsulation () of a piezo actuator () such that the piezo actuator () is protected towards the outside without having to use an additional enveloping housing-type structure, in order to produce the multilayer encapsulation (), an electrically insulating elastic layer () is first applied to the surface of the piezo actuator (), whereupon a metallic layer is applied to the electrically insulating elastic layer () so as to planarly cover the same.

Piezo actuator comprising a multilayer encapsulation, and method for the production thereof

A component involving a substrate, a layered structure arranged on the substrate, and a barrier layer arranged over the layered structure, wherein the barrier layer has the reaction product of an epoxy resin and a polymeric polyol.

Barrier layer made of a curable resin containing polymeric polyol

A method of producing a surface wave component with a drain for pyroelectric voltage includes forming electrically-conductive structures on a piezoelectric substrate. The structures form an acoustic path comprising an electroacoustic transducer. The method also includes forming a high-resistance layer on an entire surface of the substrate and on top of the electrically-conductive structures, and removing the high-resistance layer from at least a region corresponding to the electroacoustic transducer, such that at least a region outside the acoustic path remains covered by the high-resistance layer.

Method of producing a surface wave component with a drain for pyroelectric voltage

A method of encapsulating components based on organic semiconductors, includes adhesively bonding a housing to a substrate. Bonding is carried out using a UV-curable reactive adhesive including an epoxy resin, a hydroxy-functional reaction product of an epoxide compound with a phenolic compound, a silane-type adhesion promoter, and a photoinitiator, and also if desired, filler. This method is used in particular for encapsulating organic light-emitting diodes (OLEDs).

Method for encapsulating components

A composition comprises from 60-98 weight percent of a casting resin such as an epoxy resin, from 2-30 weight percent of an alcohol or sugar such as 3 (4), 8 (9)-bis(hydroxymethyl)tricyclo&lsqb;5.2.1.0,&rsqb;decane, from 0.2 to 2.0 weight percent of a thermal initiator such as an onium salt, from 0.2-2.0 weight percent of a bonding agent such as 3-glycidyloxypropyltrimethoxysilane, from 0-3.0 weight percent of a flow improver, from 0.2-5.0 weight percent of a metal complex with an organic ligand such as an amino acid, acetate, carbonic acid, amine and acetylacetonate including zinc di-(2-ethylhexanoate) and from 0-4 weight percent of a thixotropic agent and/or a flow modifier.

Heat-setting single-component LVA (low viscosity adhesive) system for bonding in the micro-range

The invention relates to a single-component adhesive system that consists at least of a casting resin, in particular of an epoxy casting resin, and a multivalent alcohol. The low-viscosity adhesive system can be microdosed, is stable in storage, is completely hardenable and is suitable for applications in which the dimensional tolerances are in the &mgr;m and sub-&mgr;m region.

Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-range

A rapid and precise cementing of components to a surface is achieved using a specially modified cement on an epoxy base in that the parts to be cemented are precisely aligned at the cemented location, are fixed with UV light and are subsequently thermally hardened.

Method for cementing a component to a surface

Halogen-free epoxy resins that arise from the addition of an epoxy component to a phenol component with base catalysis are disclosed, whereby the molar mass can be adjusted by means of the molar ratios of the initial materials. The resulting resins can be used in the field of electronics, both as molding compounds and as circuit board materials and adhesives.

Halogen-free epoxy resin

A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.

One-component epoxy resin for covering electronic components

Method of producing an attenuating structure on a surface wave component

One-component reactive resin system comprising a cure-inhibiting

A radiation-curable reaction resin system, comprising a homogeneous solution of a thermoplastic and a reaction resin, whereby the proportion of the thermoplastic in the solution is approximately 3 to about 50% by weight. The reaction resin system has a stable shelf life. Further, the reaction resin system can be cured by radiation to form a shaped material, comprising a continuous and a discontinuous phase and which exhibits thermoplastic-like behavior.

Radiation-curable reaction resin system

UV-curable adhesive semiconductor chip mounting process

Growing community of inventors

Olching, Germany

Heiner Bayer