Advanced Micro Devices Corporation

Globalfoundries Inc.

Heiko Wagner

Rolf Seltmann

Jan Raebiger

Sidheswara Mahapatra

Rolf Stephan

Kay Hellig

Uwe Schulze

Wolfram Grundke

Uwe Liebold

Ronald Grünz

The present disclosure relates to techniques for supplying different chemical products to process tools of a manufacturing environment used for micro-processing substrates. To this end, the various types of chemical products may be supplied by providing mobile dispense devices having incorporated therein any required hardware components for dispensing a chemical product. Moreover, the mobile dispense devices are appropriately equipped so as to enable coupling to and removal from respective process tools, such as wafer tracks of modern lithography tools. Due to the mobile or modular nature of the respective chemical product lines, a significant reduction of cost of ownership, increased tool availability and reduced investment costs may be achieved compared to conventional regimes.

Mobile dispense device for chemicals used in micro-processing

A method includes providing a semiconductor processing system that includes a plurality of units. Each unit has a configuration that defines a predetermined orientation of a wafer that is provided in the unit and includes a plurality of wafer handling elements. An arrangement of the plurality of wafer handling elements of the unit relative to the predetermined orientation of the wafer is adjustable. For each of the plurality of units, the arrangement of the plurality of wafer handling elements of the unit is adjusted relative to the predetermined orientation of the wafer. For each of the plurality of units, an arrangement of the plurality of wafer handling elements relative to the predetermined orientation of the wafer is provided that is different from the arrangement of the plurality of wafer handling elements relative to the predetermined orientation of the wafer in one or more other units of the plurality of units.

Method including an adjustment of a plurality of wafer handling elements, system including a plurality of wafer handling elements and photolithography track

The RMS database for a semiconductor process line is established on the basis of product groups or categories, wherein all members of a category are linked by a common feature, such as a common basic design or a common basic technology. Common process recipes in a specified category may then be set up only once, thereby reducing the amount of effort for establishing the database. Moreover, new product types may be readily incorporated into the categories, thereby enabling the employment of the already-established category-specific context information.

Method of providing context specific recipes in a semiconductor facility by defining product categories

By providing a detailed hierarchical structure for an APC algorithm and by dynamically adapting a hierarchical level in this structure, an efficient utilization of controller data is ensured, while at the same time a large number of process conditions may be taken into consideration without requiring a re-design of the hierarchical structure.

Method of operating an advanced process controller by dynamically adapting hierarchy levels

The electrical performance of sub-devices is detected and the corresponding measurement data is used to control a lithography process so as to compensate for any type of process variations during a manufacturing sequence.

Method and system for increasing product yield by controlling lithography on the basis of electrical speed data

An advanced control system for a photolithography tool that receives measurement data relating to inline parameters varying with position on a substrate surface. The position sensitive measurement data is used to establish a position dependent target offset for an exposure map, thereby effectively compensating for substrate non-uniformities. Since the inline measurement data is available significantly earlier in comparison to electrical measurement data of a completed circuit element, a more accurate exposure map may be obtained taking into account the process history of the substrates.

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Dresden, Germany

Heiko Wagner