Heraeus Deutschland Gmbh & Co Kg

Heraeus Precious Metals Gmbh & Co. Kg

W.c. Heraeus Gmbh

W.c. Heraeus Gmbh & Co Kg

Medtronic, Inc.

Heraeus Medevio Gmbh & Co. Kg

Saes Smart Materials

W. C. Hereaus Gmbh

W.c. Heraeus Gmbh & Co.

Heraeus Medical Components LLC

Heraeus Materials Singapore Pte. Ltd.

Heiko Specht

Jens Troetzschel

Frank Krüger

Andreas Reisinger

Oliver Keitel

Goran Pavlovic

Matthias Frericks

Herwig Schiefer

Christoph Vogt

Ulrich Hausch

Stefan Schibli

Christiane Leitold

Jacob Markham

Ilias Nikolaidis

Jörg-Martin Gebert

Hans-Jurgen Wachter

Hans-Jürgen Wachter

Joachim Hossick-Schott

Klaus Ruppert

Alfred Hohmann

Jeremy Glynn

Robert Sievi

Jens Trötzschel

Francis E Sczerzenie

René Richter

Zhen Yun Liu

Sai Srikanth Golagani Venkata Kanaka

David Meder

Anna Fuchs

Radhakrishnan M Manjeri

Weimin Yin

Frank Krueger

Egbert Stiedl

Kelly Stichter

Laurent Bataillard

Parth Bhimani

Larry Lark

One aspect relates to a process for manufacturing an electrochemical sensor, including moving a metal wire from a wire feed unit to a wire pick-up unit, the moving wire passing at least one printer Pwhich is located in between the wire feed and wire pick-up units, and printing an ink which includes electrically conductive particles by the printer Ponto discrete arrays of an electrically insulating polymer coating which is present on the metal wire.

Method for manufacturing an electrochemical sensor

One aspect relates to a method for the manufacture of a medical electrode, including: (i) providing a substrate; (ii) applying a composition onto the substrate, wherein the composition comprises (a) a non-aqueous solvent and (b) an organic precious metal complex compound that is dissolved in the solvent; (iii) heating the composition and thereby forming a precious metal layer on the substrate, wherein the solubility of the organic precious metal complex compound in propylene glycol mono-propyl ether at 25&#xb0; C. and 1013 hPa is at least 1 mass percent, or at least 2, 3, 4, 5 or 10 mass percent, in relation to the total mass of the composition.

Method for the manufacture of precious metal electrodes

The disclosure relates to a method for manufacturing a biocompatible wire, a biocompatible wire comprising a biocompatible metallic material and a medical device comprising such wire. The method for manufacturing a biocompatible wire comprises providing a workpiece of a biocompatible metallic material, cold working the workpiece into a wire, and annealing the wire, wherein a cold work percentage is 97 to 99%, wherein the cold working is a drawing with a die reduction per pass ratio in a range of 6 to 40%, and wherein the annealing is done in a range of 850 to 1100&#xb0; C.

Method for manufacturing a biocompatible wire

One aspect relates to a conductive polymer composite based sensor, a detection unit comprising such sensor, a method for manufacturing a conductive polymer composite based sensor, and a use of the conductive polymer composite based sensor or the detection unit. The conductive polymer composite based sensor includes a substrate and a sensor material. The sensor material includes an insulating polymer matrix component and an electrically conductive component dispersed in the polymer matrix component to form the conductive polymer composite. The sensor material is pre-strained and applied to the substrate to form the sensor.

Conductive polymer composite based sensor

One aspect generally relates to a Cr, Ni, Mo and Co alloy, with tightly controlled levels of impurities. One aspect relates to an alloy including about 10 to about 30 weight % Cr, about 20 to about 50 weight % Ni, about 2 to about 20 weight % Mo, about 10 to about 50 weight % Co, and less than about 0.01 weight % Al, wherein each weight % is based on the total weight of the alloy.

Cr, Ni, Mo and Co alloy for use in medical devices

One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes forming a holding element for holding the electrical bushing in the implantable medical device, the holding element including a through-opening. An insulation element of aluminum oxide is formed within the through-opening. At least one elongated conduction element is formed extending through insulation element. The at least one elongated conduction element includes an aluminum oxide in a metallic matrix. The insulation element and the at least one elongated conduction element are jointly fired thereby forming a hermetic seal therebetween without welding or soldering.

Method of producing a cermet-containing bushing for an implantable medical device

One aspect is a capacitor, having a multitude of parallel insulator layers in one stack direction, made of an electrically non-conducting material, a multitude of conductor layers alternatingly stacked with the insulator layers in the direction of the stack made from a conductive material and at least one contact body. At least some of the conductor layers are connected to one another in a conductive manner via the contact body. The contact body extends through breaks form several insulator layers, where at least the insulator layers are made of a sintered material;

Capacitor and method to manufacture the capacitor

One aspect relates to a medical implant, for example, implantable stimulation electrode, having a tight substrate and a porous contact region. One aspect also relates to a lead of a cardiac pacemaker having an implantable stimulation electrode and to a method for manufacturing a medical implant, for example, an implantable stimulation electrode. A medical implant according to one aspect is characterized in that the implant includes a sintered body with graduated porosity.

Medical implant

An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The cermet of the conducting element and the base body include one or more of the same ceramic compound.

Ceramic bushing for an implantable medical device

One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes generating an insulation element green compact for an insulation element from an insulating composition of materials. The insulation element green compact is partially sintered. At least one cermet-containing conduction element green compact for a conduction element is formed. The at least one conduction element green compact is introduced into the insulation element green compact. The insulation element green compact and the at least one conduction element green compact are fired to obtain an insulation element with at least one conduction element.

One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold.

Structuring three-dimensional components with non-diffusing noble or special metals and their alloys, with use being made of sputter technology

One aspect relates to a method for connecting a housing of an active implantable medical device to a head part, whereby an uncured joining agent that is arranged, at least in part, between the housing and the head part is transitioned into a cured joining agent to attain a firmly bonded connection. In one embodiment, the uncured joining agent includes monomers of a (meth)acrylic acid alkyl ester, and the cured joining agent includes at least one polymer of the (meth)acrylic acid alkyl ester.

Active implantable device

One aspect relates to an electrical bushing for use in a housing of an implantable medical device. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The electrical bushing includes a holding element to hold the electrical bushing in or on the housing. The conducting element is set-up to establish, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body. The at least one conducting element includes at least one cermet. The holding element is made, to at least 80% by weight with respect to the holding element, from a material selected from the group consisting of a metal from any of the subgroups IV, V, VI, VIII, IX, and X of the periodic system.

Method for manufacturing an electrical bushing for an implantable medical device

Method for manufacturing a medical implant and medical implant

One aspect relates to an electrical bushing for an implantable medical device, having an annulus-like holding element for holding the electrical bushing in the implantable medical device, whereby the holding element includes a through-opening, at least one elongated conducting wire extends through the through-opening, and an insulation element for forming a hermetic seal between the holding element and the conducting wire is arranged in the through-opening. One aspect provides for a cermet-containing bearing element to be arranged between the insulation element and the conducting wire.

Electrical bushing for an implantable medical device

Growing community of inventors

Hanau, Germany

Heiko Specht