Rogers Germany Gmbh

Trumpf Photonics, Inc.

Heiko Schweiger

Jürgen Schulz-Harder

Thilo Vethake

Erich Ernstberger

Johannes Wiesend

Johann Bräutigam

Tomas Block

Michael Macher

An adapter element () for connecting a component (), such as a laser diode, to a heat sink (), comprising: a first metal layer (), which in a mounted state faces the component (), and a second metal layer (), which in the mounted state faces the heat sink (), and an intermediate layer () comprising ceramic arranged between the first metal layer () and the second metal layer (), wherein the first metal layer () and/or the second metal layer () is thicker than 40 &#x3bc;m, preferably thicker than 70 &#x3bc;m and more preferably thicker than 100 &#x3bc;m.

Adapter element for connecting a component, such as a laser diode, to a heat sink, a system comprising a laser diode, a heat sink and an adapter element and method for producing an adapter element

A package for holding metal-ceramic substrates, the package includes a tray manufactured from a flat material with at least one holder adapted to a format of the metal-ceramic substrates for holding the metal-ceramic substrates, an interior of the at least one holder of the tray being defined by a bottom and circumferentially by an edge and by at least one covering completely accommodating the tray, and the tray is sealed vacuum-tight by the covering and the covering has an interior accommodating the tray, and the tray is impinged with a vacuum so that the metal-ceramic substrates are fixed in the at least one holder by clamping on an edge-side of the tray by forces (F) exerted on the edge resulting from the ambient pressure.

Package for metal-ceramic substrate and method for packing such substrates

A packaging for substrates, in particular for metal-ceramic substrates, having a tray-like packaging part formed from a sheet material, for example a plastic sheet material by deep drawing. The packaging has at least one seat formed by an indentation in an upper base section of the packaging part for a plurality of substrates collected together into a substrate stack or part stack.

Packaging for substrates and packaging unit having such packaging

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Oberbibrach, Germany

Heiko Schweiger