Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Dystar Colours Deutschland Gmbh

Heiko Brunner

Lars Kohlmann

Philip Hartmann

Klaus-Dieter Schulz

Dirk Rohde

Olivier Mann

Stefanie Ackermann

Agnieszka Witczak

Wolfgang Dahms

Philipp Wachter

Christian Sparing

Andreas Kirbs

Christopher Grieser, Legal Representative

Andreas Walter

Michael Krapp

Olanda Grieser, Legal Representative

Josef Gaida

Gerhard Epple

Holger Bera

Udo Grieser

Bernd Roelfs

Angela Llavona-Serrano

Gerhard Steinberger

Thomas Huelsmann

Arno Clicque

Patrick Brooks

Adrian Zee

Mike Briese

Torsten Voss

Björn Dingwerth

Christof Suchentrunk

Thomas Moritz

Jan Sperling

Thomas Pliet

Akif Özkök

Michael Merschky

Frank Brüning

Jörg Schulze

Sven Rückbrod

Richard Richter

Timo Bangerter

Bernd Froese

Lukas Bedrnik

Mauro Castellani

Matthias Dammasch

Grigory Vazhenin

Pamela Cebulla

Sengül Karasahin

Simon Pape

Ellen Habig

Thomas Beck

Christian Ohde

Rangarajan Jagannathan

Kinga Haubner

James Adolf

Peter Haack

Sandra Heyde

Jun Wu

Anna Peter

Thomas Hülsmann

Sandra Lucks

Manuel Pölleth

Desthree Darwin

Sandra Niemann

Angelo Ferro

Andre Schmökel

Jan Picalek

Iulia Bejan

Carsten Krause

Jöerg Schulze

Aylin Machmor

Bernd Fröese

Ulrike Engelhardt

Tobias Bernhard

Sven Ruckbrod

Sven Luttmann

Frank Hilbert

Agnieszka Wenzel

Taybet Bilkay

Sven RÜCKBROD

Bernd Fröse

Aylin Sönmez

Arno Clique

Erwin Lucic

Günther Widler

Klaus Dieter Schulz

The invention relates to aqueous acidic plating baths for electrodeposition of copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Copper electroplating bath

The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.

Metal or metal alloy deposition composition and plating compound

An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising 

Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy

The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.

Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions

The present invention concerns pyridinium compounds, a synthesis method for their preparation, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths. The plating baths are particularly suitable for use in filling of recessed structures in the electronics and semiconductor industry including dual damascene applications.

Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths

The present invention relates to bisurea derivatives and their use in aqueous plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions and a bisurea derivative. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.

Electrolytic copper plating bath compositions and a method for their use

The invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the invention comprises a source for palladium ions, a reducing agent for palladium ions and an unsaturated compound. The aqueous plating bath composition according to the invention has an improved stability against undesired decomposition due to the unsaturated compounds while keeping the deposition rate for palladium at the desired satisfying value. The aqueous plating bath composition has also a prolonged life time. The unsaturated compounds of the invention allow for adjusting the deposition rate to a satisfying range over the bath life time and for electrolessly depositing palladium layers at lower temperatures.

Plating bath composition and method for electroless plating of palladium

A method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. The method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (I), wherein:

Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound

The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallization of display applications.

Plating bath compositions for electroless plating of metals and metal alloys

Disclosed is a chemical compound useful in a galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or bright nickel alloy coating characterized in that the chemical compound has general formula IA: in which in general formula IA, Rand R&#x2550;-CHCHor Rand Rtaken together with the N atom form a pyrrolidine ring or a morpholine ring.

3-(carbamoyl) pyridinium-1-YL-propane-1-sulfonates useful in electroplating baths

The present invention is related to a galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy coating characterized in that the electroplating bath comprises at least one compound having the general formula (I) 

Galvanic nickel electroplating bath for depositing a semi-bright nickel

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Copper plating bath composition

The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).

A pyrophosphate-containing bath for the cyanide-free deposition of copper alloys on substrate surfaces, comprising a reaction product of a secondary monoamine with a diglycidyl ether, is described. The electrolyte bath is suitable for the galvanic deposition of glossy white, even and uniform copper-tin alloy coatings.

Pyrophosphate-containing bath for cyanide-free deposition of copper-tin alloys

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Berlin, Germany

Heiko Brunner