Agilent Technologies, Inc.

Tyco Electronics Corporation

Heidi Linch Reynolds

Terry P Bowen

Giles Humpston

Gary Richard Trott

Yoshikatsu Ichimura

Michael James Nystrom

David James Anvar

Daniel J Miller

Nancy M Mar

An interposer comprising: (a) a planar substrate having top and bottom surfaces, said bottom surface defining at least one ferrule alignment structure, and one or more fiber bores extending from said bottom surface to said top surface, each fiber bore being in a certain position relative to said ferrule alignment structure and adapted to receive a fiber; (b) one or more lenses on or near said top surface, each lens aligned with one of said fiber bores; (c) at least one ferrule having an end face and comprising one or more fibers protruding from said end face, and at least one alignment feature cooperating with said ferrule alignment structure to position said ferrule precisely on said bottom surface such that said fibers are disposed in said fiber bores and are optically coupled with said lenses; and (d) at least one optical component having one or more optical interfaces and being mounted on said top surface such that each of said optical interfaces is aligned with one of said fiber bores and is optically coupled with one of said lenses corresponding to said one of said fiber bores.

Interposer

Arrays are provided for multiplexed evanescent scanning by allowing for high-contrast Surface Plasmon Resonance images thereof. The arrays target features are typically biopolymeric in nature, though they may be any sort of chemical or ligand. The type of scanning is such that there is no need for probe labeling. As no labeling is required, a broader range of applications than otherwise possible is facilitated. In the subject arrays, target features are set upon a noble metal film deposited on a substrate. Interfeature areas are adapted to trap, divert and/or bleed-away light so that light directed through the substrate will not be reflected by those areas and interfere with evanescent scanning of the reflective areas upon which intended target features are provided. Geometric and materials-based light attenuating features are contemplated. Arrays as described, hardware and software as required for reading such arrays, and associated methodology are covered.

Arrays for multiplexed surface plasmon resonance detection of biological molecules

A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 &#x3bc;m and preferably about 5 &#x3bc;m) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.

Compliant and hermetic solder seal

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Palo Alto, CA, United States of America

Heidi Linch Reynolds