Hzo, Inc.

Heidi L Popeck

Tyler Christensen Child

Caleb Edward Kanavel

Samuel R Anderson

T Wade Fallin

Vimal Kumar Kasagani

Cameron LaMar Loose

Colin LaMar Loose

Xiaowei Shen

Apparatuses and systems that enable selective removal of protective coatings from substrates are disclosed. Such a material removal system may use pressurized solid carbon dioxide (CO) (i.e., dry ice) to remove a selected portion of a protective coating from a substrate. The material removal system may include one or more templates that provide selectivity in removing protective coatings from one or more substrates, fixtures for holding one or more substrates in place while material removal processes occur and apparatuses for positioning one or more substrates at desired locations in material removal systems.

Equipment for removing protective coatings from substrates

Processes for masking electronic devices, including, but not limited to, electronic subassemblies, prior to the application of protective coatings to the electronic devices are disclosed. Such processes include the use of a plurality of different masking techniques in combination to mask the electronic device. Different masking techniques may be used to mask different features and/or components of the electronic device. Some features and/or components may be masked by way of two or more masking techniques. With one or more masks in place, an electronic device may be protectively coated. After a protective coating has been applied to the electronic device, at least a portion of the mask(s) may be removed from the electronic device. Protectively coated electronic devices may then be assembled with one another.

Use of combined masking techniques and/or combined material removal techniques to protectively coat electronic devices

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Herriman, UT, United States of America

Heidi L Popeck