Hwatsing Technology Co., Ltd.

Hegeng Mei

Xinchun Lu

Jianbin Luo

Tongqing Wang

Yongyong He

Pan Shen

Zhenjie Xu

Dewen Zhao

Lianqing Zhang

Zhaohui Pei

A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a 'thickness' direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine.

Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the same

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Beijing, China

Hegeng Mei