Samsung Electronics Co., Ltd.

Heesu Kim

Seong-Hee Park

Myounghwan Lee

Kwanghoon Han

Sungmin Jo

Chilyoul Yang

Bonggyu Kang

Junsik Park

Namsu Kim

Youngsoo Jang

Janghee Lee

KwangSoo Park

Yongha Kim

Kyungsuk Kim

Youngmin Ku

A semiconductor package includes a package board, at least one semiconductor chip disposed on the package board, a molding member disposed on the package board and at least partially surrounding the at least one semiconductor chip, and a heat dissipation member disposed on the at least one semiconductor chip and the molding member. The molding member has first region in which a plurality of uneven structures are disposed, and a second region spaced apart from an external region by the plurality of uneven structures. The plurality of uneven structures protrude to a predetermined height away from the semiconductor chip, the molding member, and the heat dissipation member, and may be formed as a part of the head dissipation member, or formed separately.

Semiconductor package including uneven structures and electronic device including the same

An IC includes a pad, a current detection device connected to the pad and configured to generate monitoring information corresponding to an electrostatic discharge (ESD) event, and an internal circuit configured to receive the monitoring information from the current detection device, wherein the current detection device includes a current sensing circuit having a T-coil that is configured to generate an ESD current when the ESD event occurs and is further configured to generate an induced voltage corresponding to the ESD current, a plurality of detection circuits outputting a detection signal based on the induced voltage, and a monitoring circuit configured to receive the detection signal from each of the plurality of detection circuits and configured to generate the monitoring information, wherein the plurality of detection circuits have different sensitivities with respect to the induced voltage.

Integrated circuit having current detection device and operating method thereof

A semiconductor device includes an internal circuit connected to at least one pad. A first inductor element is connected between the at least one pad and the internal circuit, a second inductor element coupled to the first inductor element and generating an induced voltage due to an overcurrent flowing in the first inductor element. An event detection circuit includes a monitoring element connected to the second inductor element. The monitoring element is configured to generate an event detection signal by sensing changes in properties of the monitoring element caused by at least one of the induced voltages generated in the second inductor element and a current flowing in the second inductor element. The internal circuit supplies an operating voltage to the event detection circuit, and determines whether an event causing the overcurrent has occurred by receiving the event detection signal from the event detection circuit.

Semiconductor device

In a method of manufacturing an integrated circuit involving performing an electrostatic discharge (ESD) test, a weak frequency band is detected by sequentially radiating a plurality of first electromagnetic waves on a first test board including the integrated circuit. First peak-to-peak voltage signals are detected by sequentially radiating the plurality of first electromagnetic waves on a second test board including an electromagnetic wave receiving module. A frequency spectrum is detected by radiating a second electromagnetic wave on a housing including a third test board including the electromagnetic wave receiving module. A second peak-to-peak voltage signal is generated based on the weak frequency band, the first peak-to-peak voltage signals and the frequency spectrum. An ESD characteristic associated with an electronic system including the integrated circuit is predicted based on the second peak-to-peak voltage signal.

Method of manufacturing an integrated circuit involving performing an electrostatic discharge test and electrostatic discharge test system performing the same

A technique for sensor network, Machine to Machine (M2M), Machine Type Communication (MTC), and Internet of Things (IoT) is provided. A method for operating an electronic device according to an embodiment of the present disclosure includes receiving data for distance measurement between devices, wherein the electronic device is a first device among the devices, and determining positions of the devices using distances between the devices determined based on the data.

Apparatus and method for measuring positions of devices

The present disclosure relates to a technology for a sensor network, a machine to machine (M2M), a machine type communication (MTC), and internet of things (IoT). The present disclosure may be used for an intelligence service (smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, and security and safety-related service). An electronic device and an operation method for sharing a service or contents between electronic devices through a user's simple motion are provided. The method includes, displaying a user interface (UI) for contents, the UI comprising a object for sharing the contents, transmitting a signal for determining a distance between each of the at least another electronic device and the electronic device to at least another electronic device in response to an input for the object, and transmitting information for the contents to the first electronic device via a peer-to-peer (P2P) communication in response to receiving a first signal from a first electronic device.

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Seoul, South Korea

Heesu Kim