Growing community of inventors

Seoul, South Korea

Heeman Choe

Average Co-Inventor Count = 3.69

ph-index = 5

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 75

Heeman ChoeJohn H Stevens (7 patents)Heeman ChoeJames Leslie Overstreet (5 patents)Heeman ChoeJimmy Wayne Eason (5 patents)Heeman ChoeJames C Westhoff (5 patents)Heeman ChoeEric Charles Sullivan (2 patents)Heeman ChoeDaewoong Suh (1 patent)Heeman ChoeHeeman Choe (8 patents)John H StevensJohn H Stevens (52 patents)James Leslie OverstreetJames Leslie Overstreet (68 patents)Jimmy Wayne EasonJimmy Wayne Eason (57 patents)James C WesthoffJames C Westhoff (16 patents)Eric Charles SullivanEric Charles Sullivan (91 patents)Daewoong SuhDaewoong Suh (40 patents)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Baker Hughes Corporation (7 from 5,728 patents)

2. Intel Corporation (1 from 54,750 patents)


8 patents:

1. 8616089 - Method of making an earth-boring particle-matrix rotary drill bit

2. 8230762 - Methods of forming earth-boring rotary drill bits including bit bodies having boron carbide particles in aluminum or aluminum-based alloy matrix materials

3. 8201648 - Earth-boring particle-matrix rotary drill bit and method of making the same

4. 8074750 - Earth-boring tools comprising silicon carbide composite materials, and methods of forming same

5. 7913779 - Earth-boring rotary drill bits including bit bodies having boron carbide particles in aluminum or aluminum-based alloy matrix materials, and methods for forming such bits

6. 7807099 - Method for forming earth-boring tools comprising silicon carbide composite materials

7. 7784567 - Earth-boring rotary drill bits including bit bodies comprising reinforced titanium or titanium-based alloy matrix materials, and methods for forming such bits

8. 7745013 - Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing same

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as of
12/25/2025
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