Lg Chem, Ltd

Hee Yong Shim

Changbo Shim

Hyunsung Min

Young Chan Kim

Chang Bo Shim

Hyun Sung Min

Seung Hyun Song

Hwayeon Moon

Hwa Yeon Moon

Mi Seon Kim

Minhyuk Yun

Seunghyun Song

Won Ki Kim

Yong Seon Hwang

Yongseon Hwang

Gilsang Son

Jung Jin Shim

The present disclosure relates to a thermosetting resin composition for a semiconductor package including an amine compound containing a specific functional group, a thermosetting resin, a thermoplastic resin, and an inorganic filler, and having a glass transition temperature of 230° C. or less after curing, a prepreg including the thermosetting resin composition, and a metal clad laminate including the prepreg.

Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the same

The present disclosure relates to a thermosetting resin composite having a specific thermal stress factor, and capable of implementing a low glass transition temperature, low modulus, and a low coefficient of thermal expansion, and minimizing warpage, and having excellent flowability in a prepreg or semi-cured state, and a metal clad laminate using the same.

Thermosetting resin composite and metal clad laminate using the same

The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same

The present invention relates to a thermosetting resin composition for coating a metal film having excellent crack resistance and a metal laminate using the same.

Thermosetting resin composition for coating metal thin film and metal laminate using the same

The present invention relates to a thermosetting resin composition for coating a metal film having high flowability and pattern-filling property and a metal laminate using the same.

The present invention relates to a resin composition having a high flow property, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

Resin composition for semiconductor package, prepreg and metal clad laminate using the same

A thermosetting resin composition having improved flowability and stiffness, and a prepreg using the same. Specifically, three kinds of fillers having different average particle diameters are combined with a binder resin system including an epoxy resin, a bismaleimide resin, a diaminodiphenylsulfone resin, and a benzoxazine resin.

Thermosetting resin composition for semiconductor package and prepreg using the same

The present invention relates to a resin composition having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.

Resin composition for semiconductor package, prepreg, and metal clad laminate using the same

A resin composition, optionally for a semiconductor package, and a prepreg and a metal clad laminate using the same are provided. The resin composition according to the present invention may exhibit excellent flowability although being packed with a high content of an inorganic filler, and may provide a prepreg and a metal clad laminate having excellent adhesive strength for a metal foil, and low relative permittivity and a low dissipation factor.

Resin composition for semiconductor package, and prepreg and metal clad laminate using the same

The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

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Daejeon, South Korea

Hee Yong Shim