Koh Young Technology Inc.

Hee-Wook You

Hee-Tae Kim

Joong-Ki Jeong

Min-young Kim

Ja-Geun Kim

Jae-Sik Yang

Hyun-Seok Lee

Ho Jun Kim

Bong-Ha Hwang

Kwang-Ill Kho

Soo-Young Cho

Jae-Myeong Song

In order to inspect a substrate, an image information of a substrate before applying solder is displayed. Then, at least one inspection region on the substrate is image-captured to obtain an image of the inspection region that is image-captured. Then, image information that is to be displayed is renewed and the renewed image information is displayed. And, in order to inspect a foreign substance, obtained image of the inspection region is compared with a reference image of the substrate. Therefore, an operator can easily catch a region corresponding to a specific region of the image that is displayed, and easily detect a foreign substance on the substrate.

Method of inspecting foreign substance on substrate

A method of inspecting a substrate is disclosed. The method is performed by a substrate-inspecting apparatus having at least one projecting module projecting a patterned light onto a substrate fixed on a stage and an inspecting module with a camera capturing an image, and inspecting a plurality of inspection regions of the substrate step by step. The method comprises, setting an inspection order of the inspecting regions according to a lengthwise direction of the substrate, estimating height displacement of a target inspection region by using a tendency information regarding at least one previous inspection region that is already inspected, adjusting height of the inspecting module by using the estimated height displacement of the target inspection region, and inspecting the target inspection region by using the inspecting module of which height is adjusted. Therefore, inspection time is reduced.

Method of inspecting a substrate

In order to measure a measurement target on a PCB, height information of the PCB is acquired by using a first image photographed by illuminating a grating pattern light onto the PCB. Then, a first area protruding on the PCB by greater than a reference height is determined as the measurement target by using the height information. Thereafter, color information of the PCB is acquired by using a second image photographed by illuminating light onto the PCB. Then, the first color information of the first area determined as the measurement target out of the color information of the PCB is set as reference color information. Thereafter, the reference color information is compared with color information of an area except for the first area to judge whether the measurement target is formed in the area except for the first area. Thus, the measurement target may be accurately measured.

Method of measuring measurement target

In order to establish a lighting intensity of an inspection apparatus, an inspection board is installed in an inspection apparatus. Then, a width of a histogram of a captured image acquired through a camera of the inspection apparatus is adjusted to avoid from a dark region and a bright region. Thereafter, a lighting intensity of the inspection apparatus is adjusted by adjusting the histogram to be near a middle of a graph. Thus, a setting time of an inspection condition stored in a job file may be reduced to increase the user's convenience, and measurement error due to mis-establishment may be reduced to enhance inspection precision.

Method of checking an inspection apparatus and method of establishing a measurement variable of the inspection apparatus

A three dimensional shape measurement apparatus includes m projecting sections, each of which includes a light source and a grating element, and, while moving the grating element by n times, projects a grating pattern light onto a measurement target for each movement, wherein the 'n' and the 'm' are natural numbers greater than or equal to 2, an imaging section photographing a grating pattern image reflected by the measurement target, and a control section controlling that, while photographing the grating pattern image by using one of the m projecting sections, a grating element of at least another projecting section is moved. Thus, measurement time may be reduced.

Growing community of inventors

Anyang-si, South Korea

Hee-Wook You