Seoul Semiconductor Co., Ltd.

Hee Tak Oh

Do Hyung Kim

Jung Hwa Jung

You Jin Kwon

Oh Sug Kim

Kwang Il Park

Jeong A Han

Sang Cheol Lee

Woong Jun Hwang

A light-emitting diode package includes a package body. The package body includes an upper insulation substrate including upper conductive patterns, a lower insulation substrate including lower conductive patterns, and middle conductive patterns disposed between the upper insulation substrate and the lower insulation substrate. The package body also includes an upper via disposed in the upper insulation substrate, a lower via disposed in the lower insulation substrate, the upper via and the lower via not overlaid with each other.

Light emitting diode package

An aspherical lens includes a light entrance plane configured to receive light emitted from a light source and a light exit plane configured to radiate the light received by the light entrance plane. The light exit plane includes semispherical convex portions disposed on an upper surface of the aspherical lens, a concavely depressed portion comprising an overlapping region where the semispherical convex portions partially overlap each other at a central axis, a side portion connected with the semispherical convex portions, and an upper surface of each of the semispherical convex portions having a first flat portion.

Aspherical LED lens and light emitting device including the same

A light-emitting diode package includes a package body and a light-emitting diode chip disposed on the package body. The package body includes upper conductive patterns disposed on an upper insulation substrate, a lower insulation substrate disposed on lower conductive patterns, and middle conductive patterns disposed between the upper insulation substrate and the lower insulation substrate. The package body also includes upper vias electrically connecting each of the upper conductive patterns to each of the middle conductive patterns, respectively, the upper vias being disposed in the upper insulation substrate, and lower vias electrically connecting each of the middle conductive patterns to each of the lower conductive patterns, respectively, the lower vias disposed in the lower insulation substrate.

A light emitting diode package includes a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes.

Exemplary embodiments of the present invention relate to an aspherical light emitting diode (LED) lens and a light emitting device including the same. The aspherical LED lens includes a light exit plane concavely depressed near a central axis, a light entrance plane including a conical plane having a vertex located on the central axis, and a plurality of protrusions arranged on a portion of a side surface of the light exit plane. The aspherical LED lens has a radially symmetrical structure with respect to the central axis.

Disclosed herein is a light emitting diode package including a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes.

Growing community of inventors

Ansan-si, South Korea

Hee Tak Oh