Dongbu Hitek Co., Ltd.

Dongbu Electronics, Co. Ltd.

Db Hitek Co., Ltd.

Dongbu Anam Semiconductor, Inc.

Dongbu Hitekco., Ltd.

Hee Sung Shim

Joo Ho Hwang

Seong Min Lee

Joon Hwang

Yong In Han

Tae Woo Kim

Min Ah Chae

An analog-to-digital converter includes an analog-to-digital conversion unit configured to output first and second digital signals based on a comparison of first and second reference voltages with an input signal, an amplifier including first and second input terminals and an output terminal, a first capacitor having one end or electrode connected to the first input terminal of the amplifier, a second capacitor having one end or electrode connected to the first input terminal of the amplifier, a third capacitor having one end or electrode connected to the first input terminal of the amplifier, a switch unit configured to selectively provide a third or fourth reference voltage to at least one of the second and third capacitors based on the first and second digital signals, and a control switch between another end or electrode of the first capacitor and the output terminal of the amplifier.

Analog-to-digital converter

An image sensor includes a pixel array including a plurality of unit pixels in a matrix including rows and columns, a selection unit configured to select outputs of some of the columns of the pixel array and output selection output signals, and an analog-digital conversion block including a plurality of analog-digital conversion units corresponding to the columns of the pixel array. First ones of the plurality of analog-digital conversion units include analog-digital conversion blocks configured to convert the selection output signals and output digital data. When the first analog-digital conversion units convert the selection output signals, second ones of the plurality of analog-digital conversion units are turned off.

Image sensor and sensing method thereof

An image sensor may include a pixel array including an active pixel area including active pixels and a dark pixel area including dark pixels, an analog-to-digital conversion unit configured to generate a dark pixel data code by converting an analog output of each of the dark pixels and an active pixel data code by converting an analog output of each of the active pixels, an offset extractor configured to extract a final offset using the dark pixel data code, and a corrector configured to correct the active pixel data code using the final offset. The corrector outputs one of a correction pixel data code and a reference code as a corrected result from the active pixel data code and the reference code. The correction pixel data code is obtained by correcting the active pixel data code using the final offset.

Image sensor including active pixel area and dark pixel area correction

An image sensor includes a pixel array including a plurality of unit pixels in a matrix including rows and columns. The matrix being divided into a plurality of groups and each of the plurality of groups includes two or more different columns, a binning sampling unit configured to sample outputs of unit pixels in each of the plurality of groups and output binning sampling signals, and an analog-digital conversion block including first and second analog-digital conversion units corresponding to the columns. The first analog-digital conversion units convert the binning sampling signals. When the first analog-digital conversion units convert the binning sampling signals, the second analog-digital conversion units are turned off.

Image sensor

Disclosed is an image sensor that includes a pixel array including a plurality of unit pixels in a matrix having rows and columns, a binning sampling unit configured to (i) amplify with different gains signals from unit pixels selected from the unit pixels in each of the columns, and (ii) output a binning sampling signal according to an average of the amplified signals, and an analog-to-digital converter configured to convert the binning sampling signal to a digital signal.

Disclosed is an image sensor. The disclosed image sensor includes a pixel array including a plurality of unit pixels arranged in a matrix form having rows and columns, a binning sampling unit configured to output a binning sampling signal according to an average of signals from two or more unit pixels selected from among the unit pixels of each of the columns, and an analog-to-digital converter configured to convert the binning sampling signal to a digital signal. The selected unit pixels have different exposure times.

An image sensor is provided. An image sensor can include a plurality of unit pixels. Each of the unit pixels can include a photoelectric converter as a light receiving element. In each unit pixel, a transport switching unit can transport charges in the photoelectric converter to a floating diffusion region, and a first switching unit can selectively connect the floating diffusion region to a first sensing line. A second switching unit can selectively connect the floating diffusion region to a second sensing line, and a first sensing part can be connected to the first sensing line, and a second sensing part can be connected to the second sensing line.

Image sensor and method of driving the same

An image sensor is provided. The image sensor comprises a readout circuitry, a first image sensing device, an interconnection, and a second image sensing device. The readout circuitry is disposed in a first substrate. The first image sensing device is disposed at one side of the readout circuitry of the first substrate. The interconnection is disposed over the first substrate and electrically connected to the readout circuitry. The second image sensing device is disposed over the interconnection.

Image sensor including two image sensing devices in a pixel and method for manufacturing the same

Provided are an image sensor and a method for manufacturing the same. The image sensor comprises a readout circuitry, an interconnection, an image sensing device, a first conductive-type ion implantation layer, and a via plug. The readout circuitry is formed in a first substrate. The interconnection is formed over the first substrate. The interconnection is electrically connected to the readout circuitry. Then image sensing device is formed over the interconnection. The image sensing device comprises a first conductive-type conductive layer and a second conductive-type conductive layer. The first conductive-type ion implantation layer is formed in a portion of the second conductive-type conductive layer of the image sensing device. The via plug penetrates through the first conductive-type ion implantation layer and the first conductive-type conductive layer to electrically connect the first conductive-type conductive layer to the interconnection.

Image sensor and method for manufacturing the same

The embodiment relates to a complementary metal oxide semiconductor (CMOS) image sensor and more particularly, to a CMOS image sensor and a manufacturing method thereof capable of improving electron storing capacity in a floating diffusion area. The CMOS image sensor includes a first gate electrode on a semiconductor substrate; a photodiode in the semiconductor substrate on one side of the first gate electrode; a floating diffusion area in the semiconductor substrate on an opposite side of the first gate electrode; a capacitor including a lower capacitor electrode connected to the floating diffusion area, a dielectric layer on the lower capacitor electrode, and an upper capacitor electrode; a drive capacitor coupled to the lower capacitor electrode and having a second gate electrode connected to the floating diffusion area. The electron storing capacity of the floating diffusion node is increased, making it possible to improve the dynamic range of the image sensor.

CMOS image sensor and manufacturing method thereof

Embodiments relate to a Complementary Metal Oxide Semiconductor (CMOS) image sensor, and to a method for manufacturing the same, that improves the low-light level characteristics of the CMOS image sensor. The CMOS image sensor has a photosensor unit and a signal processing unit, and may include a semiconductor substrate having a device isolating implant area provided with a first ion implant area and a complementary second ion implant area within the first ion implant area; a device isolating layer in the signal processing unit; a photodiode in the photosensor unit; and transistors in the signal processing unit. A crystal defect zone neighboring the photodiode may be minimized using the device isolating implant area between adjacent photodiodes so that a source of dark current can be reduced and the occurrence of interface traps can be prevented, making it possible to improve the low-light level characteristics of the image sensor.

CMOS image sensor and method for manufacturing the same

An image sensor includes a metal interconnection and readout circuitry over a first substrate, an image sensing device, and an ion implantation isolation layer. The image sensing device is over the metal interconnection, and an ion implantation isolation layer is in the image sensing device. The image sensing device includes first, second and third color image sensing units, and ion implantation contact layers. The first, second and third color image sensing units are stacked in or on a second substrate. The ion implantation contact layers are electrically connected to the first, second and third color image sensing units, respectively.

A method for manufacturing a CMOS image sensor that independently forms a poly routing line connected to a gate poly of a reset transistor is provided. In an embodiment, a semiconductor substrate is prepared defining a device isolation region and an active region. Subsequently, a plurality of gate polys are formed on a predetermined portion of the active region. A photodiode is formed in a portion of the semiconductor substrate located at one side of one of the plurality of gate polys. After an oxide layer is deposited on the semiconductor substrate including the gate polys, the oxide layer is selectively removed to form oxide layer patterns for exposing a portion of the plurality of gate polys. After a polysilicon layer is deposited on the oxide layer pattern, the polysilicon layer is selectively removed to form a routing line connected to the portion of the plurality of gate polys.

Method for manufacturing CMOS image sensor

Provided is a method for fabricating CMOS image sensor. One method includes: preparing a semiconductor substrate in which a photodiode region and a transistor region are defined; sequentially forming an insulating layer and a conductive layer on an entire surface of the semiconductor substrate; forming a photoresist pattern for a gate electrode on the conductive layer; etching the conductive layer to a predetermined thickness using the photoresist pattern as a mask; performing an ion implantation process on the etched conductive layer to form a doped conductive layer; performing an oxidation process on the resultant structure including the doped conductive layer for oxidizing the doped conductive layer so as to form an oxide layer; and removing the oxide layer and the insulating layer disposed thereunder to define a gate electrode and a gate insulating layer.

Method for fabricating CMOS image sensor

A method for manufacturing CMOS image sensor is provided. The method includes: forming an interlayer dielectric on a semiconductor substrate on which a plurality of photodiodes are formed; forming a plurality of color filters at regular intervals on the interlayer dielectric; forming a planarization layer on an entire surface of the semiconductor substrate including the color filters; forming sacrificial resist patterns on the planarization layer, the sacrificial resist patterns being spaced apart from each other; forming spacers at sidewalls of the sacrificial resist patterns; removing the sacrificial resist patterns; forming a resist layer on the planarization layer on which only the spacers remain; removing the spacers; and reflowing the resist layer at a predetermined temperature to form a microlens.

Growing community of inventors

Gangneung-si, South Korea

Hee Sung Shim