Samsung Electro-Mechanics Co., Ltd.

Hee Sun Oh

Jong Yun Kim

Gye Won Lee

Chang Ju Lee

Hong Seok Lee

Mun Sun Jung

Seung Pil Jung

Sol Ji Chang

Nam Gyun Yim

Yong Wook Kim

Si Young Kwon

Woo Sung Jung

Mi Jung Kim

Eun Bae Park

Hee Jun Park

A touch sensing module includes a sensing coil, a metal portion disposed to be spaced apart from the sensing coil, and a first bracket having one surface, on which the metal portion is disposed, and an other surface, opposing the one surface, on which a pad having a capacitance, configured to vary as a touch is applied, is disposed.

Touch sensing module and electronic device including the same

An apparatus that detects a rotor input is provided. The apparatus includes a rotor comprising at least a portion which is configured to rotate around an axis of rotation; a reactance element disposed in the rotor, a sensing medium member disposed in the rotor, and a motion conversion member configured to move in the rotor based on a rotation of the portion of the rotor, and configured to move together with the sensing medium member to change a reactance of the reactance element according to the rotation of the portion of the rotor.

Rotor input detection apparatus and electronic device including the same

An apparatus with rotor input detection includes: a first reactance element disposed at a rotor configured such that at least a part of the rotor rotates around a rotation axis, and disposed at the rotor such that reactance of the first reactance element varies depending on relative rotation between a first portion of the rotor and a second portion of the rotor; and a second reactance element disposed at the rotor such that reactance of the second reactance element varies depending on a contact or a force applied to a side surface of the rotor. The first and second reactance elements are configured to detect inputs of different areas of the rotor.

Apparatus with rotor input detection, and electronic device including apparatus with rotor input detection

A device with touch sensing. The device includes a first sensor configured to detect a touch and to provide a first sensing signal, a second sensor configured to detect another touch and to provide a second sensing signal, a threshold generator configured to set a first threshold by a reflecting of an amount of change of the second sensing signal to an initial threshold, and a sensor circuit configured to generate a first differential signal based on the first sensing signal, and to determine a first touch based on a consideration of the first threshold with respect to a first signal generated based on the first differential signal and the first sensing signal.

Electronic device and device with touch sensing

A touch sensing device employed in an electronic device having a housing including a plurality of touch members, includes a touch sensing unit disposed in the housing and including a plurality of touch sensors configured to perform touch sensing based on a touch applied to any one or any two or more of the plurality of touch members; an oscillation circuit unit configured to generate a plurality of touch sensing signals based on the touch sensing; and a signal processor configured to perform a slide mode, when any one of the plurality of touch sensing signals is a slide mode start touch, to determine whether a slide touch pattern input based on the plurality of touch sensing signals is a preset slide touch pattern.

Electronic device with touch sensing devices

A device with touch sensing includes a bracket, a pad disposed above one side of the bracket, the pad having a capacitance that varies as a touch is applied proximate to the device, and a sensing coil disposed below another side of the bracket that opposes the one side, with at least a portion of the sensing coil overlapping the pad.

Touch sensing device

An electronic device includes a force-sensing apparatus. The force-sensing apparatus includes a planar-shaped frame, a force sensor, and a displacement portion. The force sensor is disposed on one surface of the frame. The displacement portion has a planar profile and one side coupled at an acute angle to the frame and another side freely disposed above a sensing surface of the force sensor.

Electronic device with force-sensing apparatus

An electronic component module includes a first substrate mounted on an upper surface of a second substrate such that at least a portion of a lower surface of the first substrate is exposed externally of the second substrate and electronic devices mounted on the first substrate and the second substrate, including at least one electronic device mounted on the upper surface of the second substrate.

Electronic component module

An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.

Electronic component module and method for manufacturing the same

A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.

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Suwon-si, South Korea

Hee Sun Oh