Samsung Electro-Mechanics Co., Ltd.

Hee Suk Chung

Suk Jin Ham

Mi Yang Kim

Kyung Ho Lee

Jin Uk Cha

Gyu Sik Kim

Se Yoon Park

Han Wool Kang

Gyu Seok Kim

Eun Ju Yang

There is provided an In nanowire including a substrate, an indium thin film formed on the substrate, an insulating film formed on the indium thin film and having at least one through hole through formation of a pattern, and an In nanowire vertically protruded from the indium thin film through the at least one through hole.

In nanowire, device using the same and method of manufacturing in nanowire

Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.

Printed circuit board and method of manufacturing the same

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Gyunggi-do, South Korea

Hee Suk Chung