Samsung Electronics Co., Ltd.

Hee-Sang Yang

Jong-Hoon Kim

Ju-il Kang

Jae-nam Lee

Jong-in Lee

Min-Gu Chang

Jong-Chul Kim

Yo-Se Eum

In-Cheol Kim

Chang-hwan Ji

Ho-Soo Jang

Sung-yeol Lee

Yong-Kyun Sun

Yu-Dong Won

Woo-Chul Jeon

Tai-Kew Choi

A carrier transfer for automatically transferring a substrate carrier includes a gripper detachably coupled to the substrate carrier, the substrate carrier including a plurality of substrates and at least one open gate through which the plurality of substrates are loaded into or unloaded from the substrate carrier. The gripper includes a gate blocking unit secured to the gripper and configured to shift to a blocking position, the blocking position being a position of the gate blocking unit that partially blocks the gate to prevent the plurality of substrates from being separated from the substrate carrier during the automatic transferring of the substrate carrier.

Automatic carrier transfer for transferring a substrate carrier in a semiconductor manufacturing post-process and method of transferring the substrate carrier using the same

A locking apparatus for locking a magazine configured to receive a printed circuit board (PCB) may include an actuator, a rotating block, and a locking member. The actuator may be installed on the magazine. The rotating block may be connected to the actuator. The rotating block may be rotated about a vertical axis. The locking member may be rotatably connected to the magazine about the vertical axis. The locking member may be selectively combined with the rotating block to block a front face of the magazine, thereby preventing breakaway of the PCB from the magazine.

Apparatus for locking a magazine

A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.

Equipment and method for cutting package

The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

Solder ball attaching system and method

Growing community of inventors

Cheonan-si, South Korea

Hee-Sang Yang