Skhynix Inc.

Hee Ra Roh

Jae Min Kim

Hyun Chul Seo

Il Hwan Cho

Dong Hwan Seol

A semiconductor package includes a substrate having an upper surface and a lower surface which faces away from the upper surface, and possessing a recess which is defined on the upper surface; and a semiconductor chip mounted to the upper surface of the substrate, having one surface which faces the upper surface and the other surface which faces away from the one surface, and warped in a smile shape such that a warped edge portion of the semiconductor chip is inserted into the recess.

Semiconductor package

A semiconductor chip includes a body part having a first surface and a second surface facing away from the first surface, and an opening passing from the first surface to the second surface of the body part.

Growing community of inventors

Seoul, South Korea

Hee Ra Roh