Raytheon Company

Hee Kyung Kim

Clifton Quan

Fangchou Yang

Alberto F Viscarra

Jar Jar Lee

Rory Kim Sorensen

Kevin C Rolston

Allen T Wang

Magdy F Iskander

Shahrokh Hashemi-Yeganeh

Derek Pruden

Edward Marsh Jackson

Robert W Ladera

A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.

Multi-layer microwave corrugated printed circuit board and method

Provided is a radiator transition assembly for exciting a long slot radiator of an antenna, the transition assembly including a folded flexible circuit substrate including at least two folds forming a long slot radiator, an excitation circuitry configured to generate signals for exciting the long slot radiator, and a microstrip transmission line coupled to the excitation circuitry and positioned along the folded flexible circuit substrate, where the microstrip transmission line extends across an opening of the long slot radiator.

Systems and methods for exciting long slot radiators of an RF antenna

A radio frequency (RF) transition for a three dimensional molded RF structure is provided. In one embodiment, the invention relates to a radio frequency (RF) transition for an RF structure, the RF transition includes an assembly having a first flexible layer, a second flexible layer, and a third flexible layer, wherein a first section of the assembly includes a microstrip transmission line, wherein a second section of the assembly includes a dielectric stripline transmission line, and wherein a third section of the assembly includes a suspended substrate stripline transmission line.

RF transition with 3-dimensional molded RF structure

Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.

Systems and methods for assembling lightweight RF antenna structures

A phase shifter comprises a substrate, a ground plane formed on a first surface of the substrate, a support structure positioned on a second surface of the substrate opposite the first surface, three parallel, non-co-planar microstrip lines supported by the support structure above the second surface of the substrate, a ferrite element supported by the support structure between the second surface of the substrate and the three non-co-planar microstrip lines, and means for applying a magnetic field to the ferrite element.

Growing community of inventors

El Segundo, CA, United States of America

Hee Kyung Kim