Samsung Display Co., Ltd.

Hee Kwon Lee

Sung Un Park

Kyu Bong Jung

Soong Won Cho

Eui Jung Kwon

A display device includes a display panel. A fingerprint sensor package at least partially overlaps the display panel. A printed circuit board (PCB) at least partially overlaps the display panel and includes a touch sensor integrated circuit (IC). The fingerprint sensor package includes a first base having a plurality of conductive patterns, an image sensor disposed on a first surface of the first base, and a first conductive layer disposed on a second surface of the first base, at least partially overlapping with the image sensor, and electrically connected to the plurality of conductive patterns of the first base via a via electrode.

Display device acquiring fingerprint pattern and touch pressure information using a single structure

Provided is a display device including: a display panel in which a display area and a non-display area located around the display area are defined; an external device which is disposed on the non-display area of the display panel; and a cover member which is disposed on the external device, wherein the external device includes a driving chip and a printed circuit film which is disposed on the non-display area of the display panel and spaced apart from the display area with the driving chip interposed between the printed circuit film and the display area in plan view, and the cover member includes a first insulating tape disposed on the external device, a first conductive tape disposed on the first insulating tape and a second insulating tape disposed on the first conductive tape, wherein the second insulating tape includes an electrostatic induction opening penetrating the second insulating tape in a thickness direction, a planar size of the first conductive tape is greater than a planar size of the second insulating tape, the first conductive tape protrudes further toward the display area than the second insulating tape in plan view, and the electrostatic induction opening is disposed on a part of the first conductive tape which protrudes further toward the display area than the second insulating tape.

Display device

A display device includes a display panel, a mold frame at least partially surrounding the display panel, and a bracket at least partially overlapping the mold frame. Each of the mold frame and the bracket includes an electrically conductive material, and the mold frame and the bracket are electrically connected to each other.

Folding display device

Fingerprint sensor package and display device including the same

Folding device display

A display device includes a display panel and a printed circuit board (PCB) connected to the display panel. The PCB includes an insulating base. A pressure sensor is disposed to overlap with the display panel. A fingerprint sensor is disposed to overlap with the display panel and is spaced apart, on a first side in a first direction, from the pressure sensor. A first distance from the pressure sensor to a first edge of the insulating base is greater than a second distance from the pressure sensor to a second edge of the insulating base opposite the fingerprint sensor.

Printed circuit board package and display device including the same

A chip-on-film package includes a base film, a test line, and an integrated circuit chip. The base film includes a bent area in which a bending occurs. The test line is disposed on the base film, and at least a portion of the test line is overlapped with the bent area. The integrated circuit chip is disposed on the base film and includes a first terminal and a second terminal. The first terminal is connected to one end of the test line to output a first signal and the second terminal is connected to the other end of the test line to receive a second signal. The integrated circuit chip detects whether a crack occurs in the bent area based on a difference value in signal characteristics.

Chip-on-film package and display device having the same

A chip-on-film package includes a base film including a bending area, an integrated circuit chip at an upper surface of the base film, a first line at the upper surface of the base film and overlapping the bending area, a second line at a lower surface of the base film and overlapping the bending area, a via pattern penetrating the base film to electrically couple the first line and the second line, and a common line coupled to the first line and to the integrated circuit chip, wherein at least a portion of the first line does not overlap at least a portion of the second line in a plan view.

Chip-on-film package and display device including the same

A chip-on-film package and a display device, the package including a base film that includes an upper surface and a lower surface, the lower surface facing the upper surface; an integrated circuit chip on the upper surface of the base film; an alignment line on the base film and being spaced apart from the integrated circuit chip; a heat discharge plate on the lower surface of the base film and having a plate shape; and at least one via pattern penetrating through the base film and electrically connecting the alignment line to the heat discharge plate.

Growing community of inventors

Asan-si, South Korea

Hee Kwon Lee