Samsung Electro-mechanics Co., Ltd.

Hee Ju Son

Jong Ho Lee

Yong Jong Park

Min Woo Kim

Jung Tae Park

Chang Ho Seo

Sang Jin Kim

Ho Joon Park

Bo Sung Ku

Byeung Gyu Chang

Sang Youl Jeon

A capacitor component includes a body including a dielectric layer, a layering portion in which first and second internal electrodes opposing each other are layered in a first direction, and first and second connecting portions disposed on both surfaces of the layering portion taken in a second direction perpendicular to the first direction and connected to the first and second internal electrodes, respectively; and first and second external electrodes disposed on the first and second connecting portions, respectively, and the first and second external electrodes include metal powder particles, a surface of each of which is coated with at least one of graphene and carbon nanotubes.

Capacitor component

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on side portions of the internal electrodes exposed to the first and second surfaces. A thickness of each of the first and second side margin portions is 10 &#x3bc;m or more and less than 45 &#x3bc;m.

Multilayer ceramic capacitor and method of manufacturing the same

There is provided a biochip stamping device. The biochip stamping device includes a stamping jig in which a first biochip is aligned; an inverting mechanism vertically inverting a second biochip; and a movement mechanism transferring the vertically inverted second biochip on the stamping jig to combine the first biochip and the second biochip.

Biochip stamping device and stamping method thereof

Provided is a method of manufacturing a ceramic probe card. A ceramic laminated body having a plurality of ceramic green sheets and an interlayer circuit including a conductive via and a conductive line formed in the plurality of ceramic green sheets is prepared. Then, at least one probe pin structure connected to the interlayer circuit is formed by selectively removing the plurality of photosensitive ceramic sheets having a ceramic powder and a photosensitive organic component on the ceramic laminated body necessarily, and by filling a metal material in a region from which the plurality of photosensitive ceramic sheets have been removed. Then, a ceramic substrate having the at least one probe pin structure is provided by simultaneously firing the ceramic laminated body and the photosensitive ceramic sheets, and by removing the photosensitive ceramic sheets.

Method of manufacturing ceramic probe card

Growing community of inventors

Suwon-si, South Korea

Hee Ju Son