E.i. Dupont De Nemours and Company

Dupont Electronics, Inc.

Dupont Safety & Construction, Inc.

Du Pont China Limited

Hee Hyun Lee

Michael Stephen Wolfe

Hoang Vi Tran

Eric Maurice Smith

Gary Delmar Jaycox

Michael Joseph Otley

Waifong Liew Anton

Viacheslav V Diev

Gregory Scott Blackman

Timothy Scott Wyant

Tristan Williams

Keith William Pollak

Michael T Pottiger

Kalyan Venkata Chalapathi Rapolu

John Donald Summers

Graciela Beatriz Blanchet

Brian Douglas Mather

Bryan Benedict Sauer

Yuefei Tao

Edmund Francis Schieffer, Jr

Esther Kim

Vincenzo Arancio

Ma Helen Cativo

Michael Pottiger

This invention provides a polymer thick film electrically conductive paste composition, comprising conductive metal powder, a resin blend of polyol and phenoxy resin, blocked aliphatic polyisocyanate and one or more polar, aprotic solvents. In one embodiment the paste composition is used to form electrically conductive adhesive. In another embodiment the paste composition is used to form an electrically conductive polymer thick film.

Flexible electrically conductive pastes and devices made therewith

This invention provides a polymer thick film dielectric paste composition, comprising a mixture of titanium dioxide and boron nitride powders, a resin blend of polyol and phenoxy resin, one or more additives selected from the group consisting of a linear aliphatic polyester, a block copolymer, a blocked aliphatic polyisocyanate, and a wetting and dispersing agent, and one or more polar, aprotic solvents. The paste composition may be used to form polymer thick film dielectric layers in electrical circuits subject to thermoforming and in articles requiring stretchable dielectric layers such as wearables.

Polymer thick film dielectric paste composition

A solid surface comprises (i) a crosslinked acrylic or unsaturated polyester resin present in an amount no greater than 52 volume fraction percent, and (ii) no greater than 48 volume fraction percent of inorganic filler particles distributed evenly throughout the solid surface wherein (a) 95-99 volume fraction percent of the filler particles has a major dimension in the range of from 0.5 to no greater than 10 microns, (b) the D50 of the filler particles is from 0.5-2.5 microns, and (c) the D90 of the filler particles is equal to or less than 10 microns.

Solid polymeric highly durable surfacing

The present invention provides a thick-film paste composition for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal and an oxide composition dispersed in an organic medium that includes an organopolysiloxane and a fluorine-containing degradation agent.

Conductive paste composition and semiconductor devices made therewith

The present invention provides a thick-film paste composition for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal and an oxide composition dispersed in an organic medium that includes microgel particles and an organopolysiloxane.

A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.

A solid surface comprises (i) a crosslinked acrylic or unsaturated polyester resin present in an amount no greater than 51 or 52 volume fraction percent, and (ii) no greater than 48 or 49 volume fraction percent of inorganic filler particles that are modified with discrete functional particles that are bound, or adhered to the filler particles, the filler particles being distributed evenly throughout the solid surface wherein (a) 95-99 volume fraction percent of the filler particles has a major dimension in the range of from 0.5 to no greater than 10 microns, (b) the D50 of the filler particles is from 0.5-2.5 microns, (c) the D90 of the filler particles is equal to or less than 10 microns and (d) the filler particles are modified with discrete functional particles that are bound, or adhered to the filler particles.

The present disclosure provides an inkjet ink comprising an aqueous vehicle and an encapsulated pigment dispersion. A process for encapsulating pigment dispersions is provided where a pigment is dispersed with a polymeric dispersant in an aqueous solvent system. The free polymer dispersant in the pigment dispersion is limited to less than 0.12 grams per gram of pigment. This dispersed pigment is then encapsulated by adding acrylate monomers and optionally acrylic and vinyl monomers and polymerizing. In the encapsulated pigment dispersion the weight ratio of final free polymer to polymer found to the final encapsulated pigment is less than 0.9. The free polymer dispersant is measured by a centrifugation method and the final free polymer is measured by a density gradient centrifugation method. Such encapsulated pigment dispersions may be used in inkjet inks and are stable to heat, aging test conditions, and solvent challenges. Prints from these inks have better durability.

Ink jet ink comprising encapsulated pigment dispersions with minimal free polymer

A process for encapsulating pigment dispersions is provided where a pigment is dispersed with a polymeric dispersant in an aqueous solvent system. The free polymer dispersant in the pigment dispersion is limited to less than 0.12 grams per gram of pigment. This dispersed pigment is then encapsulated by adding acrylate monomers and optionally acrylic and vinyl monomers and polymerizing. In the encapsulated pigment dispersion the weight ratio of final free polymer to polymer found to the final encapsulated pigment is less than 0.9. The free polymer dispersant is measured by a centrifugation method and the final free polymer is measured by a density gradient centrifugation method. Such encapsulated pigment dispersions may be used in inkjet inks and are stable to heat, aging test conditions, and solvent challenges. Prints from these inks have better durability.

Method of preparing encapsulated pigment dispersions with minimal free polymer

A process for encapsulating pigment dispersions is provided where a pigment is dispersed with a polymeric dispersant in an aqueous solvent system. An acrylate monomer and a polyurethane dispersion are added and the resultant mixture is polymerized. Optionally, the acrylate monomer/polyurethane mixture may be emulsified in water with an added surfactant or polymeric dispersant and up to 20% acrylic or other vinyl monomers based on the acrylate may be added to the acrylate monomer/polyurethane mixture before polymerization. Such encapsulated pigment dispersions may be used in inkjet inks and are stable to heat, aging test conditions, and solvent challenges. Prints from these inks have better durability.

Method of preparing encapsulated pigment dispersions which include polyurethane dispersions

Processes for encapsulating pigment dispersions is described and are used in inkjet inks providing stability with regard to heat aging test conditions and solvent challenges. Prints from these inks have better durability than prints made from dispersions that are not encapsulated.

Method of preparing encapsulated pigment dispersions with monomers which have a lower critical solution temperature

The invention provides a method to form a pattern of functional material on a substrate for use in electronic devices and components. The method uses a stamp having a relief structure to transfer a mask material to a substrate and form a pattern of open area on the substrate. The functional material is applied to the substrate in at least the open area. Contact of an adhesive material to an exterior surface opposite the substrate and separation of the adhesive from the substrate forms the pattern of functional material on the substrate. The method is suitable for the fabrication of microcircuitry for electronic devices and components.

Growing community of inventors

Wilmington, DE, United States of America

Hee Hyun Lee