Hrl Laboratories, LLC

Hector L Bracamontes

Miroslav Micovic

Keisuke Shinohara

Andrea Corrion

David T Chang

Dean C Regan

Ivan Milosavljevic

Peter J Willadsen

Colleen M Butler

Bruce T Holden

Alexandros Margomenos

David F Brown

Ivan Alvarado-Rodriguez

Methods using chemical vapor deposition (CVD) of diamond deposited on a sacrificial material provide CVD diamond microchannel structures and 3-D interconnection structures of CVD diamond microfluidic channels. The sacrificial material is patterned to define locations and dimensions of the microchannels. The patterned sacrificial material is selectively removed from underneath the chemical vapor deposited (CVD) diamond to form the CVD diamond microchannels. The CVD diamond microchannels are integrated with electronic structures to provide an integral microfluidic cooling system to electronic devices.

Fabrication of microfluidic channels in diamond

A method for fabricating a gate structure for a field effect transistor having a buffer layer on a substrate, a channel layer and a barrier layer over the channel layer includes forming a gate of a first dielectric, forming first sidewalls of a second dielectric on either side and adjacent to the gate, selectively etching into the buffer layer to form a mesa for the field effect transistor, depositing a dielectric layer over the mesa, planarizing the dielectric layer over the mesa to form a planarized surface such that a top of the gate, tops of the first sidewalls, and a top of the dielectric layer over the mesa are on the same planarized surface, depositing metal on the planzarized surface, annealing to form the gate into a metal silicided gate, and etching to remove excess non-silicided metal.

Gate metallization methods for self-aligned sidewall gate GaN HEMT

A method for fabricating a gate structure for a field effect transistor having a buffer layer on a substrate, a channel layer and a barrier layer over the channel layer includes forming a gate including silicon, forming first sidewalls of a first material on either side and adjacent to the gate, selectively etching into the buffer layer to form a mesa for the field effect transistor, depositing a material layer over the mesa, planarizing the material layer over the mesa to form a planarized surface such that a top of the gate, tops of the first sidewalls, and a top of the material layer over the mesa are on the same planarized surface, depositing metal on the planzarized surface, annealing to form the gate into a metal silicided gate, and etching to remove excess non-silicided metal.

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Lawndale, CA, United States of America

Hector L Bracamontes