Harris Corporation

Eagle Technology, LLC

Hector Deju

Walter M Whybrew

Gregory M Jandzio

Gary A Rief

Brian Scott Smith

Donald J Beck

Brett A Pigon

James B Nichols

Steven E Wilson

Joey D Sartin

Stephen Rego

Kelly V Hillman

Scott Burri

Daniel C Lizana

Larry E Crider

Joseph Kreuzpaintner

Thomas K Buschor

A satellite system may include a reflector and a mast extending outwardly from the reflector. A radio frequency (RF) assembly may be carried by a distal end of the mast and include a conductive waveguide body having an RF cavity therein coupled with the reflector and a pin-receiving opening therein. An RF circuit module may include a housing carried by the conductive waveguide body, RF circuitry contained within the housing, and a signal coupling pin coupled to the RF circuitry and extending through the pin-receiving opening into the RF cavity.

Satellite system having radio frequency assembly with signal coupling pin and associated methods

At least one flexible appliance () and related method () for orthogonal, non-planar interconnections of at least a first electronic interface () disposed on a substrate () to an associated second electronic interface () positioned beneath the substrate (). The flexible appliance () is comprised of a planar body () having at least one electrical connector () extending from and orthogonally oriented relative to the planar body (). In one aspect of the invention, the electrical connector () is four electrical connectors (). There is at least one aperture () formed in the substrate () for allowing the first electronic interface () to be electrically interconnected to the associated second electronic interface (). The flexible appliance () is positioned on the substrate () by automated means. Contacts pads () on the resilient connector () are electrically connected to the second electronic interface () and the first electronic interface () by automated means such as soldering, thermo sonic bonding, or gap welding.

Flexible appliance and related method for orthogonal, non-planar interconnections

A thermosonic ribbon bonding process uses a combination of a relatively low temperature and a high frequency to bond a ribbon conductor to conductive bonding sites of a system level support structure, such as a space/airborne antenna, containing circuit components whose characteristics might otherwise be degraded at an elevated temperature customarily used in device-level thermosonic bonding processes. By relatively low temperature is meant a temperature no greater than the minimum temperature that would potentially cause a modification of the circuit parameters of at least one of the system's components. Such a minimum temperature may lie in a range on the order of 25-85.degree. C., while the ultrasonic bonding frequency preferably lies in a range of from 122 KHz to 140 KHz. For gold ribbon to gold pad bonds, this high frequency range achieves the requisite atomic diffusion bonding energy, without causing fracturing or destruction of the gold ribbon or its interface with the gold pad.

High frequency, low temperature thermosonic ribbon bonding process for

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Indialantic, FL, United States of America

Hector Deju