3m Innovative Properties Company

Minnesota Mining and Manufacturing Company

Heather K Kranz

David A Kaisaki

Julia P Williams

Craig F Lamphere

Chong Yong Kim

Thomas Edward Wood

Brian Leroy Koster

L Charles Hardy

Janet R Kirkman

Jeffrey A Boettcher

Thomas P Klun

Patricia M Savu

Scott R Culler

John Charles Clark

John J Gagliardi

Andrew T Ruff

Yaoqi Joe Liu

Bruce E Tait

Carl R Kessel

Peter T Dietz

Wesley J Bruxvoort

Richard J Webb

Philip G Clark

Kwok-Lun Ho

Robert P Messner

Thomas J Conway

David K Mortenson

Einar O Vaage

An optical sheet suitable for use in a laminate comprising at least one glazing component. The optical sheet comprises a non-metallic multi-layer optical film that has multiple optical layers, and can be, for example, a solar energy reflective film (e.g., an infrared radiation reflective film). The multiple layers are thermally and/or otherwise fused together along all, substantially all or at least a substantial portion of the peripheral edge of at least the optical film, so as to prevent or at least substantially reduce the occurrence or degree of delamination of the multiple layers along all, substantially all, or the substantial portion of the peripheral edge of the optical film. At least the optical film can be dimensioned such that, when bonded to a glazing component, all, substantially all or at least the substantial portion of the peripheral edge of at least the optical film is positionable so as to be co-extensive with or substantially co-extensive with a corresponding portion of the peripheral edge of the glazing component to which the optical sheet is to be bonded.

Laminates and methods of making same

The disclosure pertains to compositions and methods for modifying or refining the surface of a wafer suited for semiconductor fabrication. The compositions include working liquids useful in modifying a surface of a wafer suited for fabrication of a semiconductor device. In some embodiments, the working liquids are aqueous solutions of initial components substantially free of loose abrasive particles, the components including water, a surfactant, and a pH buffer exhibiting at least one pKgreater than 7. In certain embodiments, the pH buffer includes a basic pH adjusting agent and an acidic complexing agent, and the working liquid exhibits a pH from about 7 to about 12. In further embodiments, the disclosure provides a fixed abrasive article comprising a surfactant suitable for modifying the surface of a wafer, and a method of making the fixed abrasive article. Additional embodiments describe methods that may be used to modify a wafer surface.

Compositions and methods for modifying a surface suited for semiconductor fabrication

A transparent optical film laminate and a method of making such a laminate. The laminate can include a transparent optical sheet comprising a non-metallic multi-layer optical film sandwiched between first and second bonding sheets. The optical sheet and the bonding sheets are also sandwiched between two glazing components. A substantial portion of the peripheral edge of the optical film lies within or beyond the peripheral edge of at least one of the glazing components. The peripheral edge of the optical film may have a portion that lies within and a portion that lies beyond the peripheral edge of at least one of the glazing components.

Laminates

A birefringent dielectric multilayer film that reflects in a wavelength region of interest, and preferably reflects at least 50% of light in a band at least 100 nm wide, preferably positioned between wavelengths from about 700 nm to about 2000 nm. The film is heat set to render the film capable of shrinking to conform without substantial wrinkling to a substrate having a compound curvature. The film may be laminated to form a wide variety of non-planar articles.

Wrinkle resistant infrared reflecting film and non-planar laminate articles made therefrom

This invention pertains to a method of modifying or refining a surface of a wafer suited for semiconductor fabrication. This method may be used to modify a wafer having an unmodified, exposed surface comprised of a layer of a second material deployed over at least one discrete feature of a first material attached to the wafer. A first step of this method comprises contacting and relatively moving the exposed surface of the wafer with respect to an abrasive article, wherein the abrasive article comprises an exposed surface of a plurality of three-dimensional abrasive composites comprising a plurality of abrasive particles fixed and dispersed in a binder and maintaining contact to effect removal of the second material. In a second step, the contact and relative motion are continued until an exposed surface of the wafer has at least one area of exposed first material and at least one area of exposed second material.

Method of planarizing the upper surface of a semiconductor wafer

The present invention relates to a method and an article for rapidly polishing a glass workpiece surface using a structured abrasive article including cerium oxide particles dispersed in a binder. The abrasive article for rapid polishing of a glass workpiece comprising a backing and at least one polishing layer. The polishing layer comprises cerium oxide particles dispersed within a binder. The binder provides the attachment means of the at least one polishing layer to the backing. The abrasive article is capable of reducing an initial Rtm of about 0.8 .mu.m or greater on a glass test blank to a final Rtm of about 0.3 .mu.m or less in about one minute using an RPE procedure defined herein. The present invention is also directed to a method of polishing a glass workpiece using the present abrasive article.

Method and article for the production of optical quality surfaces on

A method of modifying an exposed surface of a semiconductor wafer that includes the steps of:

Method of modifying an exposed surface of a semiconductor wafer

Growing community of inventors

North Oaks, MN, United States of America

Heather K Kranz