Skhynix Inc.

Hynix Semiconductor Inc.

Heat Bit Park

Dong Uk Lee

Ji Hwan Kim

Jong Chern Lee

Kee Teok Park

Kang Seol Lee

Tae Sik Yun

Hong Gyeom Kim

An address and command generation circuit, and a semiconductor system are disclosed. The address and command generation circuit may include a column address generator configured to correct an error of a column address, generate an internal column address based on an uncorrected column address when the column address corresponds to a read command, and generate the internal column address based on the corrected column address when the column address corresponds to a write command.

Address and command generation circuit, and semiconductor system

A semiconductor device includes a plurality of stacked chips is disclosed. Each of the stacked chips includes a plurality of through vias arranged in a regular polygonal shape. The through vias of each chip are formed at corresponding positions in a stacked direction. The respective through vias of each chip are electrically connected to through vias of a chip adjacent in the stacked direction in a manner that the connected through vias are spaced apart from one another in substantially the same direction.

Semiconductor device

The invention may include a semiconductor apparatus comprising: a first die configured to latch and output external input data according to a strobe signal, to detect a valid pulse from among pulses of the strobe signal, and to generate a valid signal; and a second die configured to write data transmitted from the first die in response to the valid signal.

Stack type semiconductor apparatus

A semiconductor apparatus having a through via to be electrically coupled with a chip includes a latch memory cell configured to be electrically coupled with the through via and receive a signal transmitted through the through via, and output a stored signal to the through via.

Semiconductor apparatus and testing method thereof

A semiconductor apparatus with a through via includes a semiconductor chip and a through via formed by penetrating through the semiconductor chip. The system further includes a first metal layer connected to a portion of the through via at an end of the through via and a second metal layer connected to another portion of the through via at the end of the through via.

Semiconductor apparatus having through via capable of testing connectivity of through via

The semiconductor apparatus includes a reference delay value check unit configured to receive a source signal and delay the source signal to generate a reference delay signal; a process delay value check unit configured to receive the source signal and delay the source signal to generate a process delay signal; and a signal generation unit configured to receive the reference delay signal and the process delay signal, receive an input signal, and variably delay the input signal based on the reference delay signal and the process delay signal to generate an output signal.

Semiconductor apparatus, method for delaying signal thereof, stacked semiconductor memory apparatus, and method for generating signal thereof

Provided is a semiconductor apparatus including a plurality of semiconductor chips coupled through an electrical coupling unit. Each of the semiconductor chips includes: a chip ID signal generation unit configured to generate a chip ID signal; and a chip enable signal generation unit configured to receive a clock enable signal in response to the chip ID signal, wherein one of the semiconductor chips shares the received clock enable signal as a transfer clock enable signal with the other semiconductor chips, and the chip enable signal generation unit detects whether or not an error occurs in the chip ID signals of the plurality of semiconductor chips, selects any one of the transfer clock enable signal and the clock enable signal applied, and outputs the selected signal as a chip enable signal.

Semiconductor apparatus and semiconductor system

A semiconductor apparatus having a data bit inversion function and, the semiconductor apparatus including a first semiconductor chip and a second semiconductor chip electrically coupled to the first semiconductor chip, wherein the first semiconductor chip may be configured to receive data and a data bit inversion flag, and transfer the data to the second semiconductor chip, and the second semiconductor chip may be configured to invert and store the data, which is transferred from the first semiconductor chip, according to to the data bit inversion flag.

Semiconductor apparatus having a data bit inversion function

A semiconductor apparatus includes a multi-chip module which multi-chip module comprises a first and a second chips. The semiconductor apparatus comprises a first data line in the first chip to carry first read data; a first controller, in the first chip, configured to generate first output data on a first output data line in the first chip based on the first read data transmitted from the first data line; a first data transmitter configured to electrically connect the first output data line to the second chip.

Semiconductor apparatus

A semiconductor memory apparatus having stacked first and second chips includes a first chip test signal generation unit disposed in the first chip and configured to generate a first chip test signal in response to a first chip compression data determination signal in a test mode, a second chip test signal generation unit disposed in the second chip and configured to generate a second chip test signal in response to a second chip compression data determination signal in the test mode, and a final data determination unit configured to generate a final test signal in response to the first and second chip test signals in the test mode.

Semiconductor memory apparatus including data compression test circuit

A semiconductor memory apparatus includes: a read/write control unit configured to generate a write control signal and a read control signal using internal signals generated through separate signal paths in response to a write command and a read command respectively; and a plurality of ranks configured to perform a write operation or read operation according to the write control signal or the read control signal.

Semiconductor memory apparatus and read/write control method thereof

A semiconductor memory apparatus is provided. The semiconductor memory apparatus comprises: first and second memory banks located a predetermined distance from each other in a first direction; a common column selection control unit located at an outside region in the first and second memory banks in the first direction, and configured to commonly control access to column areas in the first and second memory banks and generate a column selection signal that controls data access to the corresponding memory cells in the first and second memory banks; a first data read/write unit configured to sense and amplify read data transferred from the first memory bank and transfer write data to the first memory bank; and a second data read/write unit configured to sense and amplify read data transferred from the second memory bank and transfer write data to the second memory bank. The first data read/write unit and the second data read/write unit are located so as to be spaced from each other in the first direction with the memory bank interposed therebetween.

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Icheon-si, South Korea

Heat Bit Park