Kaikutek Inc.

He-Sheng Lin

Yi-Cheng Lin

Mike Chun-Hung Wang

An antenna packaging structure includes a top substrate, an antenna chip, a bottom substrate, and a plurality of antenna transmission lines. The top substrate includes an antenna. The bottom substrate includes a circuit. The antenna chip is mounted on the bottom substrate, and is electrically connected to the antenna of the top substrate through the circuit of the bottom substrate and the antenna transmission lines. Since the antenna chip is directly electrically connected to a processor through the circuit, a plurality of communication lines do not need to be electrically connected between the antenna and the circuit. Further, since the antenna transmission lines just need to transmit a simple antenna signal between the antenna and the antenna chip, an amount of the antenna transmission lines is smaller than an amount of communication lines. Moreover, the total size of the antenna packaging structure is reduced.

Antenna packaging structure

An anti-EMI antenna includes a first substrate layer, a grounding layer, a first circuit layer, a second substrate layer, a second circuit layer, a third substrate layer, a third circuit layer, a fourth substrate layer, and a fourth circuit layer. The grounding layer is mounted on a bottom surface of the first substrate layer, and includes a grounding circuit. The grounding circuit fully covers the bottom surface of the first substrate layer. Since the grounding circuit fully covers the bottom surface of the first substrate layer, the antenna radiation circuit can prevent the EMI from a bottom side of the anti-EMI antenna. Therefore, electromagnetic waves can be mostly isolated to prevent noise caused by the EMI.

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Taoyuan, Taiwan

He-Sheng Lin