Tpk Advanced Solutions Inc.

He Luo

Chen-Hsin Chang

Xian-Bin Xu

Ming-Qiang Fu

Xiong-Min Zhang

A bonding pad structure includes a substrate, a flexible printed circuit board, and a plurality of bonding pins. The bonding pins include at least one central bonding pin and at least two first bonding pins. The at least one central bonding pin is located at a center of bonding pins. The at least two first bonding pins are located farthest away from the at least one central bonding pin and have mirror symmetry with respect to the at least one central bonding pin. The at least one central bonding pin includes a first end and a second end. A first width A of the first end and a second width B of the second end satisfy 0&#x3c;A/B&#x2264;1. A tilt angle &#x3b8; is formed between one of the at least two first bonding pins and one side of the substrate and satisfies 0&#x3c;&#x3b8;&#x2264;90.

Bonding pad structure for electronic device and manufacturing method thereof

An electronic device includes a substrate and a flexible printed circuit board. The substrate includes a plurality of first pins disposed on the substrate. The flexible printed circuit board includes a plurality of second pins disposed on the flexible printed circuit board. The first pins and the second pins are bonded to each other to form a plurality of bonding points. The bonding points include at least one central bonding point and at least one first bonding point. The at least one central bonding point is located in a central area of the electronic device. The at least one first bonding point is located in a first area of the electronic device. The first area is located outside the central area. A line width of the at least one first bonding point is greater than a line width of the at least one central bonding point.

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Longchang, China

He Luo