Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Fu Zhun Precision Ind. (shenzhen) Co., Ltd.

He-Ben Liu

Hsieh Kun Lee

Wan-Lin Xia

A mounting device () for mounting a heat sink () to a circuit board (), includes a locking member () extending through the heat sink and including a through hole () and barbs () formed in one end portion thereof for engaging with the circuit board, an operation member () including a cylinder () and a rod () extending from the cylinder into the through hole of the locking member. First and second bumps () are formed in the locking member, and a pair of slots () is defined in the cylinder for engaging with the first and second bumps at first and second positions respectively. A spring () is received in the cylinder, surrounding the rod and compressed between an end of the cylinder and the first bumps. The rod expands the barbs outwardly at the second position and releases the barbs at the first position.

Mounting device for heat sink

A heat dissipation device includes a mounting plate () for mounting the heat dissipation device to a circuit board () on which a CPU () and a plurality of capacitors () are mounted, a heat sink (), a core (), and a fan () mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder () and a plurality of curved fins () extending outwardly from the cylinder. The core includes a base () for contacting the CPU and a post () extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings () for providing access for cooled air from the fan to the CPU and the capacitors.

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Shenzhen, China

He-Ben Liu