Samsung Display Co., Ltd.

Hayoung Choi

Chung-Seok Lee

Jihong Hwang

Joonsam Kim

Soyeon Joo

Dongbin Um

Kyeongyeol Heo

Hyeondeuk Hwang

Hoikwan Lee

Sangduk Lee

Sang-chul Byun

Hyunkyung Yun

Eun-Kyung Yeon

A method for manufacturing a display device includes: preparing a display panel including a first region, a bending region, and a second region, which are arranged in a first direction; disposing a release film overlapping the bending region on the display panel; applying a resin onto the first region to form a resin coating layer; pressing the resin coating layer, using a stamp coated with a release material; and curing the resin coating layer to form a preliminary resin layer.

Display device and method for manufacturing the same

A display device includes a display panel, a circuit board, a first conductive film, first and second lower films, and first and second adhesive layers. The display panel includes a display area and a pad area which includes a first pad part. The circuit board is attached on the display panel and includes a lead part overlapping the first pad part. The first conductive film is between the display panel and the circuit board and electrically connects the first pad part and the lead part to each other. The first and second lower films are attached to the display panel to respectively correspond to the display area and the pad area. A thickness of the second adhesive layer between the display panel and the second lower film is less than a thickness of the first adhesive layer between the display panel and the first lower film.

Display device and method of providing the same

An electronic device includes a display panel having first pads, a circuit board that includes second pads corresponding to the first pads, and a conductive adhesive member disposed between the display panel and the circuit board to connect the first pads and the second pads, in which the conductive adhesive member includes a first resin layer adjacent to the display panel, a second resin layer disposed between the first resin layer and the circuit board and having a curing agent different from that of the first resin layer, and conductive particles disposed in the first resin layer wherein at least one of the second pads protrudes through the second resin layer and is in contact with the conductive particles.

Electronic device and method of manufacturing the same

A display panel includes a base substrate, pixels, signal lines, a power line, signal pads, power pads, and a conductive portion electrically connected to the power pads and extending from an area overlapping the power pads to an edge of the base substrate. An opening is defined in conductive portion by a removed portion thereof.

Display panel with conductive portion overlapping power pads

A display device including a lower substrate having a display area and a pad area, a display structure disposed in the display area of the lower substrate, pad electrodes disposed in the pad area of the lower substrate and spaced apart in a first direction, and a conductive film package including a base substrate disposed on the pad electrodes, and including a corner portion having a curved shape, bump electrodes disposed in a first portion of a bottom surface of the base substrate and overlapping the pad electrodes, metal patterns disposed in second portions of the bottom surface of the base substrate positioned at both sides of the first portion, a first film layer disposed between the base substrate and the lower substrate and overlapping the pad electrodes, a part of the bump electrodes, and the metal patterns, and conductive balls disposed inside the first film layer.

Display device

A display device includes a display panel, a bonding substrate and a bridge board. The display panel includes a pixel array disposed on a base substrate and an input pad electrically connected to the pixel array. The bonding substrate is disposed under the display panel and includes an output pad. The bridge board is bonded to the input pad of the display panel and the output pad of the bonding substrate to electrically connect the display panel to the bonding substrate, wherein the bridge board includes a rigid material.

Bonding structure and display device including the same

A method of manufacturing a display apparatus is provided as follows. A substrate having a display portion on an upper surface of the substrate is prepared. A protection film having an opening is attached to a lower surface of the substrate so that the protection film overlaps the display portion. A support film is attached to the lower surface so that the support film is disposed within the opening of the protection film. A driving circuit chip is attached to the upper surface so that the driving chip is spaced apart from the display portion and the opening. At least a part of the support film is removed. The substrate is bent along a longitudinal direction of the opening.

Display apparatus and method of manufacturing the same

A display device includes a substrate having a planar area, a bending area extending from the planar area, and a surrounding area extending from the bending area, a first protective layer at a boundary portion of the bending area, and a second protective layer covering an entire surface of the bending area and covering the first protective layer.

A display device includes a driving circuit layer including a thin film transistor, a display layer at the driving circuit layer and overlapping a portion of the driving circuit layer, a window at the display layer, a first adhesive member between the driving circuit layer and the window, and a second adhesive member between the display layer and the window and spaced from the first adhesive member in a plane view.

Growing community of inventors

Cheonan-si, South Korea

Hayoung Choi