Samsung Electronics Co., Ltd.

Hayeon Kim

Hyunjun Kim

Cheoljin Cho

Chijeong Choi

Seunga Lee

Han-Shil Choi

Kyungwoo Lim

Daekyu Lee

Sunghwa Park

Moonki Yeo

Sangkyung Park

Tae-Hyeon Yu

Ba-Da Kang

Hyun-Seok Seo

A semiconductor device includes a substrate, lower electrodes on the substrate, a dielectric layer covering the lower electrodes, and an upper electrode covering the dielectric layer. The dielectric layer includes a first region in contact with the lower electrodes, a second region in contact with the upper electrode, and a third region between the first and second regions. The third region includes a first insertion layer including a first oxide including a first metal having a first valence and a second oxide including a second metal having a second valence different from the first valence. A thickness of the dielectric layer is about 40 Å to about 60 Å. A thickness of the first insertion layer is about 3 Å to about 10 Å. A ratio of the second metal to total elements in the dielectric layer is about 5 at % to about 15 at %.

Semiconductor device

Disclosed is an electronic device comprising: a first input/output terminal; a second input/output terminal; a power source module; a first switch selectively connecting the first input/output terminal to the power source module; a second switch selectively connecting the second input/output terminal to the power source module; a diode having an anode electrically connected to the first input/output terminal and a cathode electrically connected to the power source module, so that the diode is connected in parallel to the first switch; and a control circuit for controlling the first switch and the second switch. The electronic device can prevent damage due to power from external electronic devices by controlling the first switch and the second switch in response to connection of the external electronic devices. Additional various embodiments identified through the specification are possible.

Electronic device and method for receiving power from external electronic device

Various embodiments of the present invention relate to a method and a device for controlling the operation of an external device on the basis of various states of an electronic device when the external device having a cooling function is connected in the electronic device. The electronic device according to various embodiments of the present invention comprises: an interface for connection with the external device; and a processer electrically connected to the interface. The processor can detect connection of the external device by means of the interface, determine the state of the electronic device on the basis of at least the detection of the connection with the external device, and transmit a control signal relating to fan operation control of the external device to the external device by means of the interface on the basis of at least the state of the electronic device. Various embodiments are possible.

Method and device for controlling external device in accordance with electronic device state

Growing community of inventors

Gyeonggi-do, South Korea

Hayeon Kim