Cambridge Display Technology Limited

Haydn Gregory

Julian Charles Carter

Peter John Lyon

Colin Creighton

Martin Richardson

An organic electronic device structure, the structure comprising: a substrate; a base layer supported by said substrate and defining the base of a well for solvent-based deposition of organic electronic material; one or more spacer layers formed over said base layer; a bank layer formed over said spacer layer to define a side of said well; and wherein an edge of said well adjacent said base layer is undercut to define a shelf over said base layer, said shelf defining a recess to receive said organic electronic material.

Organic electronic device structures and fabrication methods

This invention generally relates to improved methods of fabricating molecular electronic devices, in particular organic electronic devices such as organic light emitting diodes (OLEDs) by droplet deposition techniques such as ink jet printing. The invention also relates to molecular device substrates fabricated by and/or use in such methods. We describe an optical or optoelectronic device comprising a substrate and a plurality of discrete bank structures disposed on the substrate, wherein: each bank structure defines the perimeter of at least one well; one or more of a charge transporting, charge injecting, light-filtering and light-emitting material is disposed in the well; and at least one bank structure defines the perimeter of at least one well and does not extend to the perimeter of any adjacent well. Thus in embodiments no part of said perimeter defines the bank of more than one well.

Molecular electronic device fabrication methods and structures

A composition for ink jet printing an opto-electrical device, the composition comprising: an electroluminescent or charge transporting organic material; and a high boiling point solvent having a boiling point higher than water.

Solvents for PEDOT-solutions for ink-jet printing

An organic optoelectrical device comprising: a substrate; at least one first electrode disposed over the substrate; a layer of bank material disposed over the first electrode and defining a plurality of wells; a layer of organic semi-conductive material disposed in the wells; at least one second electrode disposed over the layer of organic semi-conductive material in the wells; an encapsulant disposed over the at least one second electrode; a layer of the bank material provided at a periphery of the device; and a metallic seal adhering the encapsulant to the layer of bank material at the periphery of the device, the bank material being an inorganic electrically insulating material whereby the substrate, the bank material, the metallic seal and the encapsulant form a seal at the periphery of the device.

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San Jose, CA, United States of America

Haydn Gregory