Mitsubishi Denki Kabushiki Kaisha

Hayato Takasago

Mitsuyuki Takada

Eishi Gofuku

Yoshiyuki Morihiro

Kenichi Niki

Kohei Adachi

Atsushi Endo

Tetsuro Makita

Akira Ishizu

Toru Kokogawa

Toshio Tobita

Seiki Takahashi

Hideaki Otsuki

Tohru Kokogawa

Atsushi Tanaka

Hiroaki Ideno

Hiroaki Ishitani

Takanori Takaki

Hirofumi Ohuchida

Mitsumasa Mori

Yoichiro Onishi

Mitsuyuki Tanaka

Ryusaku Tsukao

Mitiyasu Nounen

Takatomo Watanabe

Hideaki Ootsuki

A drive circuit module comprises a board formed of a hard base material having no flexibility, a circuit pattern formed on the board and having a plurality of input terminals and output terminals supported by a flexible insulation film, and a carrying section for carrying a drive LSI and the like on the circuit pattern; characterized in that the board is provided with at least one cutout on a surface opposite to the surface on which the circuit pattern of the board is formed, thereby making flexible the board in a direction in which the output terminal surface and the carrying section surface are different from each other.

Rigid circuit board for liquid crystal display including cut out for

A serial sampling video signal driving apparatus receives a plurality of color video signals. A serial sampling video driver samples the color video signals one after the other in cyclic fashion, and provides the sampled values to drive a matrix-type color display. A delay circuit delays one or more of the color video signals at different phases before input to the serial sampling video driver, thereby compensating for differences in sampling times.

Serial sampling video signal driving apparatus with improved color

In a liquid crystal display device with a drive circuit board connected to the peripheral portion of a liquid crystal display panel, the circuit board is disposed behind the liquid crystal display panel and also the circuit board is connected with the liquid crystal display panel by means of a connecting member in film form, whereby the liquid crystal display device is miniaturized and efficiency of the assembly work is improved. Further, the circuit board is made up of plural drive circuit modules of the same type whereby the efficiency in the assembly and inspection process is still improved.

Liquid crystal display device having heat-insulating members and driving

A method for separating bonded substrates which are prepared by facing a plurality of substrates and bonding the substrates by an adhesive features irradiating an energy beam on the bonding portions of the bonded substrates from above one of the bonded substrates to separate the one substrate and the other substrate. The energy beam has the property of being transmitted through the one substrate and of being absorbed into the adhesive.

Method for separating bonded substrates, in particular disassembling a

A circuit board includes a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.

Integrated circuit device having a metal substrate

A matrix-type color liquid crystal display device comprises display units each comprising each one of red (R), green (G) and blue (B) color pixels arranged in such a manner that R and B pixels on opposite sides of each G pixel belong also to adjacent display units. The R and B signals for that display unit to which the G pixel between R and B pixels of interest belongs are appropriately modified before they are applied to the R and B pixels, whereby the number of required pixels can be reduced.

Matrix-type color liquid crystal display device

Circuit board with high heat dissipations characteristic

A process for preparing a combined wiring substrate is carried out by bonding with an adhesive agent the end surfaces of the mutually opposing sides of a plurality of substrates each having a pattern of wiring on its major surface, and by connecting electrically parts of the pattern of wiring which oppose each other by interposing the bonding portion.

Process for preparing a combined wiring substrate

A multilayer interconnection circuit board includes insulating layers and conductor wiring layers which are alternately laminated. The uppermost conductor wiring layer is electrically connected to an intermediate conductor wiring layer to a predetermined stage by irradiating laser beams in the direction of lamination of layers so that the conductor wiring layer or layers located above the intermediate conductor wiring layer are successively molten by the laser beams. The surface irradiated by the laser beams of the conductor wiring layer at the predetermined stage is treated to reflect laser energy, and the surface of the conductor wiring layer or layers which are molten by the laser beams is treated so as to be susceptive to absorb the laser beams.

Multilayer interconnection circuit board

Liquid crystal display device

A method is provided for forming a circuit board which comprises a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.

Method of manufacturing a circuit board

A tape carrier for mounting and bonding an IC chip on substrate having an interconnection pattern is disclosed. The tape carrier comprises a peripheral and a central film portion made of an electrically insulating flexible material, and a set of leads carried at least one the peripheral film portion. The central portion covers the central area of the surface of the IC chip on which the bumps are formed. An aperture is formed between the peripheral and central film portion which has enough dimension to allow the leads to be bonded to the bumps of the IC chip therethrough. Some of the leads extend over the central film portion and, extending out of a side of the central film portion, reach the opposing area of the peripheral film portion across a strip of the aperture, thereby effecting electrical connection from the bumps to far-away portions of the circuitry on the substrate and between the bumps themselves. The central film portion may form an island separated from the peripheral potion by a ring-shaped aperture; alternatively, it may form a tongue-shaped appendage projecting into the aperture. The leads and the IC chip may be situated on the same surface of the film portions; alternatively, they may be situated on the opposite surfaces thereof.

Tape carrier for assembling an IC chip on a substrate

A method for producing a high density hybrid integrated circuit substrate capable of forming a very fine pattern of a conductor by means of the chemical plating and at the same time capable of applying the chemical plating, while protecting the resistor formed on the substrate in advance of the chemical plating step, the production method comprising steps of: forming a resistor on an electrically insulating substrate; forming an activating layer for depositing a chemical plating on the electrically insulating substrate in contact with the resistor; forming a stable resin layer, during the chemical plating step, by the photolithography process in a manner to cover the resistor, except for the portion of the activating layer where an electrically conductive layer is to be formed; and forming the electrically conductive layer by the chemical plating on the exposed portion of the activating layer.

Method for producing hybrid integrated circuit substrate

A method for fabricating a hybrid IC substrate comprises the steps of: preparing an insulating ceramic substrate having a major surface; baking one or more conductors of a first group formed of high melting point metal or alloy thereof on the major surface; covering the conductors of the first group with a first plated film formed by electroless plating; forming an insulating porous active including a glass component and a small amount of a metal component having a catalytic action for electroless plating on the first plated film; and forming one or more conductors of a second group by electroless plating on the active layer, whereby portions of the active layer sandwiched between the conductors of the first and second groups are rendered conductive.

Method for fabricating hybrid integrated circuit

In a testing device for testing electric circuit board having test terminals on the board parallel to each other, conductor strips are arranged in conformity with the test terminals, and a pressing member is provided for pressing the conductor strips on the test terminals.

Growing community of inventors

Amagasaki, Japan

Hayato Takasago