Nitto-denko Corporation

Hayato Takakura

Shusaku Shibata

Shuichi Wakaki

Yoshihiro Kawamura

Naoki Shibata

Masaki Ito

Takahiro Takano

Ryosuke Sasaoka

Kenya Takimoto

Yasunari Oyabu

Hiroaki Machitani

Rihito Fukushima

Chihiro Watanabe

Daigo Tsubai

Kenta Fukushima

A method for manufacturing a wiring circuit board includes first forming an insulating base layer on a one-side surface in a thickness direction of a metal sheet, second forming a conductor layer on a one-side surface in the thickness direction of the insulating base layer so that a width of a wire is smaller than a width Wof a wiring body base portion, third forming an insulating cover layer on a one-side surface in the thickness direction of the wiring body base portion exposed from the wire so that the wire is covered with the insulating cover layer and a width of a wiring body cover portion is smaller than the width W, and fourth forming a metal supporting layer by etching the metal sheet from both sides in the thickness direction so that a width of a wiring body metal portion is smaller than the width W

Wiring circuit board and method for manufacturing same

A method for producing a wiring circuit board includes a preparation step of preparing a substrate; a first patterning step of forming a first insulating layer on one side of the substrate in a thickness direction; a second patterning step of forming a conductive pattern on one side of the first insulating layer in the thickness direction; and a deposition step of depositing a metal on the other side of the substrate in the thickness direction and forming a first metal support layer. The conductive pattern has two terminals, and two wirings. The first metal support layer has a terminal support portion supporting the terminals, a wiring support portion supporting one of the wirings, and a second wiring support portion supporting the other wiring and disposed spaced from the wiring support portion.

Method for producing wiring circuit board and wiring circuit board

A method for manufacturing a wiring circuit board includes steps: 1) preparing a metal supporting layer, a different-reflectance layer, an insulating base layer, and a wiring layer sequentially toward one side in a thickness direction, and 2) irradiating the circuit board with reflected light including light containing one wavelength in light between wavelengths 650 nm and 950 nm from one side in the thickness direction of the circuit board to inspect the wiring layer based on the reflected light at the circuit board. In 2), the outer shape of the wiring layer is inspected based on the contrast between first reflected light at one surface in the thickness direction of the wiring layer and second reflected light at one surface in the thickness direction of the different-reflectance layer. The difference between a reflectance Rof the wiring layer and a reflectance Rof the different-reflectance layer is 40% or more.

Method for manufacturing wiring circuit board

A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. A thickness of the ground lead residual portion is thinner than a thickness of the first terminal.

Wiring circuit board

A wiring circuit board includes a metal supporting layer, an insulating base layer, and a wiring layer. The wiring circuit board further includes a plurality of streak groove portions disposed on one surface of the metal supporting layer in the thickness direction and a plurality of concave portions depressed in the metal supporting layer in the thickness direction. The plurality of concave portions forms a dot pattern. Each of the dots in the dot pattern has one concave surface. The concave surface has an approximately spherical cap shape or an approximately cone shape.

Wiring circuit board and wiring circuit board assembly

A wiring circuit board includes a base insulating layer; a first wiring disposed on the base insulating layer; an intermediate insulating layer disposed on the base insulating layer so as to cover the first wiring; a second wiring disposed on the intermediate insulating layer; a single layer first terminal, disposed on the base insulating layer, and electrically connected to the first wiring; and a single layer second terminal, disposed on the base insulating layer, and electrically connected to the second wiring. The first terminal is continuous with the first wiring. The second terminal is discontinuous from the second wiring. The wiring circuit board further includes a connecting portion disposed on the base insulating layer and continuous with the second terminal to electrically connect to the second wiring.

Wiring circuit board and producing method thereof

A wiring circuit board includes a base insulating layer, a conductive layer, and a metal protective film in order toward one side in a thickness direction. The conductive layer includes a signal wiring and a terminal continuous therewith. The signal wiring has one surface in the thickness direction, and first and second surfaces continuous with the one surface and disposed to face each other in a width direction. The terminal has one surface in the thickness direction, and the other surface disposed to face the one surface at the other side in the thickness direction at spaced intervals thereto. The other surface of the terminal is exposed from the base insulating layer toward the other side in the thickness direction. The metal protective film covers the one surface of the signal wiring and one surface of the terminal but not both first or second surfaces.

Provided is a wiring circuit board that allows the electrical connection between the elements and the terminals to be easy and sure. The wiring circuit board includes an insulating base layer, a plurality of wires with different thicknesses from each other, and an insulating cover layer sequentially toward an upper side. The wires include a first wire having the greatest thickness. The wiring circuit board further includes a plurality of terminals disposed on an upper surface of the insulating base layer. The terminals are electrically connected with the wires, respectively. The upper surfaces and of the terminals are each located at an upper side as compared to an upper surface of the insulating cover layer (a wire covering portion) covering the first wire.

A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. The base insulating layer has a through hole penetrating in the thickness direction. The ground lead residual portion has an opening continuous so as to surround the through hole.

A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness Tof 50 μm or more.

Wired circuit board, casing, and board containing set

A wiring circuit board includes an alignment mark layer. The alignment mark layer includes a first alignment mark and a second alignment mark. The condition A or the condition B is satisfied. Condition A: The first alignment mark has a first portion (a first starting point portion or a first center of gravity portion). The second alignment mark has a second portion (a second starting point portion or a second center of gravity portion). Condition B: The first alignment mark has the first portion, and the second alignment mark does not have the second portion, or the first alignment mark does not have the first portion, and the second alignment mark does not have the second portion.

An imaging element-mounting board includes a board area having a board disposed and a plurality of reinforcement portions disposed around the board area. The plurality of reinforcement portions are independent from each other.

Imaging element-mounting board

A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.

Wired circuit board and imaging device

A wiring circuit board sequentially includes a conductive layer, an insulating layer, and a shield layer toward one side in a thickness direction. The insulating layer covers the conductive layer and has an insulating opening portion exposing a part of a one-side surface in the thickness direction of the conductive layer, and the shield layer has a recessed portion disposed at the inside of the insulating opening portion and recessed toward the other side in the thickness direction so as to be in contact with the conductive layer. The shield layer sequentially includes an adhesive layer and a main body layer toward one side in the thickness direction. A ratio (Tb/Ta) of a thickness Tb of the main body layer to a thickness Ta of the adhesive layer is 4 or more.

An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0&#x3c;y1&#x3c;S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle &#x3b8; satisfies 0&#x3c;&#x3b8;&#x3c;1 deg.

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Osaka, Japan

Hayato Takakura