Fujitsu Corporation

Hayato Okuda

Kaname Ozawa

Yuji Akashi

Hiroyuki Matsuo

Mitsutaka Sato

Akira Takashima

Takao Nishimura

Ryuji Nomoto

Akira Okada

Tetsuya Hiraoka

Tadashi Uno

Mitsutaka Ikeda

Fumihiko Ando

Yoshihiro Tsukidate

Hiroshi Onodera

Katsuro Hiraiwa

Katsuhito Kikuma

Masahiko Harayama

An apparatus includes plural combinations of a clock supplier and a clock supply destination supplied with a clock from the clock supplier. The clock supply destination includes a return route through which the clock supply destination returns a clock to a corresponding clock supplier. The clock supplier includes a variable delay unit that adds a delay to the clock to be supplied to a corresponding clock supply destination; a comparison-reference-clock supply unit that supplies a comparison reference clock having the same phase as that of a comparison reference clock supplied from other clock supplier; a phase comparator that compares the phase of a return clock returned from a corresponding clock supply destination with that of the comparison reference clock; and a phase-difference control unit that controls the delay, so that the phases of the return clock and the comparison reference clock coincide with each other, based on the comparison result.

Information processing apparatus and phase control method

In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first semiconductor chip by flip-chip bonding. A second semiconductor chip is secured onto the printed circuit board. The second semiconductor chip is connected to the flexible printed wiring board by wire bonding. The first semiconductor chip is connected to the flexible printed wiring board by wire bonding via the printed circuit board.

Stacked semiconductor device and method of producing the same

A semiconductor device includes a substrate provided with a plurality of leads, a face-down semiconductor element provided on one surface of the substrate, a first stacked semiconductor element and a second stacked semiconductor element provided on another surface of the substrate and connected to the substrate by wires, and an extended wiring mechanism for connecting electrodes of the face-down semiconductor element and electrodes of the first and second semiconductor elements. The connected electrodes are equi-electrodes whose electrical characteristics are equal.

Semiconductor device

A semiconductor device includes the first through third semiconductor devices which are stacked on a substrate and the first through third wires for connecting the semiconductor elements and the substrate. The first wires serve to connect electrodes of the first semiconductor element positioned uppermost and electrodes of the second semiconductor element. The second wires serve to connect the electrodes of the second semiconductor element and electrodes of the third semiconductor element. The third wires serve to connect the electrodes of the third semiconductor element and bonding pads of the substrate. Between the first wires and the electrodes of the second semiconductor element and between the second wires and the electrodes of the third semiconductor element, stud bumps are provided so as to form space therebetween, thereby avoiding short-circuits therebetween.

Semiconductor device and method for producing the same

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Kawasaki, Japan

Hayato Okuda