Meidensha Corporation

Waseda University

Hayato Ochi

Rena Takahashi

Takumi Hayashi

Suguru Noda

Toshimasa Fukai

Daizo Takahashi

Yuichi Nishikiori

Hisashi Sugime

Kotaro Yasui

Sae Kitagawa

Opening edge surface () of an emitter supporting unit female screw bore () provided at an emitter supporting unit () extends along radial direction of the emitter supporting unit female screw bore (). An emitter supporting unit operation hole () provided at a flange portion () of a vacuum enclosure () has shape into which one selected from a position adjustment shaft () and a pressing shaft () can be inserted from their shaft tip sides. The position adjustment shaft is provided, on an outer circumferential surface of its tip (), with a tip side male screw portion () that can be screwed into the emitter supporting unit female screw bore (). The pressing shaft has, at its tip (), a tip surface () having a larger diameter than an opening diameter of the emitter supporting unit female screw bore () and extending along radial direction of the pressing shaft.

Field emission device, field emission method and positioning and fixing method

In a cylindrical guard electrode () provided on the outer peripheral side of an electron generation part () of an emitter (), a distal end section (A)positioned in the emission direction of an electron beam (L) from the electron generation part () includes: a distal end inner-peripheral-side part (A) having an inner-peripheral-side curved surface portion (a) convex in the emission direction; a distal end outer-peripheral-side part (A) having an outer-peripheral-side curved portion (a) convex in the emission direction; and adistal end middle part (A) positioned between the distal end inner-peripheral-side (A) and the distal end outer-peripheral-side part (A). The distal end middle part (A) has a flat surface portion (a) between the inner-peripheral-surface portion (a) and the outer-peripheral-side curved surface portion (a) so as to extend in the direction therebetween.

Guard electrode and field emission device

A vacuum container is configured so that an opening on one side and an opening on another side in the longitudinal direction of a cylindrical insulating body are sealed with an emitter unit and a target unit respectively; and a vacuum chamber is provided on the inner peripheral side of the insulating body. The emitter unit is provided with: a moving body located on the one side in the longitudinal direction in the vacuum chamber and supported so as to be movable in the longitudinal direction via a bellows; and a guard electrode located on the outer peripheral side of the moving body. An emitter section having an electron generating section is formed at a tip section of the moving body on the other side in the longitudinal direction by subjecting the surface of the tip section to film formation processing.

Field emission device and field emission method

An emitter support structure for a field emission device, the emitter support structure includes: a support portion disposed to be moved in a direction of both ends of a vacuum chamber of the field emission device, and configured to support an emitter of the field emission device; a protruding portion formed at one end portion of the support portion which confronts a target of the field emission device, and to which the emitter is inserted and mounted; a slit formed in a circumference wall portion of the protruding portion in a height direction of the circumference wall portion; and a redundant brazing material groove formed in an outside of the protruding portion along the circumference wall portion.

Emitter support structure and field emission device

It is a CNT device () (carbon-metal structure) equipped with a carbon nanotube layer () (CNT layer; same hereafter) on a metal pedestal (). The metal pedestal () is brazed to the CNT layer () with a brazing material layer () interposed therebetween. When manufacturing the CNT device (), firstly, the CNT layer () is formed on a heat-resistant textured substrate (). Next, the metal pedestal () is brazed to the CNT layer () that is on the heat-resistant textured substrate () with the brazing material layer () interposed therebetween. Then, the metal pedestal () (and the CNT layer) is peeled off the heat-resistant textured substrate () to transfer the CNT layer () from the heat-resistant textured substrate () to the metal pedestal ().

Growing community of inventors

Numadu, Japan

Hayato Ochi