Stanley Electric Co., Ltd

Hitachi Cable Precision Co., Ltd.

Hayato Oba

Masataka Kagiwada

Hiroyuki Takayama

Dai Aoki

Toshimi Kamikawa

Toshiaki Morikawa

Minoru Yamamura

Tadashi Tamaki

Eiji Ohno

Kei Teramura

Atsushi Ohtaka

Syoichi Takahashi

Shinichi Miyamura

Mikiyoshi Kawamura

Konosuke Nakada

A method for producing a light-emitting device comprising: a step of electrically connecting a first electrode provided on one main surface of a semiconductor substrate (element substrate) through a light-emitting layer, and a first lead of a lead frame, so as to oppose each other; a step of electrically connecting a second electrode provided on the rear surface of a surface provided with the light-emitting layer of said element substrate, and a second lead of the above-described lead frame; a step of encapsulating a connecting part of said first electrode and said first lead, and said second electrode, and an electrode part of the second lead, with a transparent resin; and a step of producing a discrete edge by cutting said first lead and the second lead from said lead frame; wherein a film of joining material (joining material film) made of an alloy or a single metal, is formed on the first electrode of said light-emitting element, and a pattern to reduce spreading of said joining material is formed on an element mounting part of said first lead, in advance of the step of electrically connecting the first electrode of said light-emitting element and said first lead, to reduce amount of the joining material flowing outside of a joining area wherein the first electrode is placed.

Light-emitting device manufacturing method and light-emitting device

A surface mount semiconductor device using a lead frame can suppress stress applied to a package by a load in a forming process performed for the lead frame projecting from the package at a portion at which the lead frame projects the package. Concave portions can be provided in at least one lead of a pair of leads that project laterally from side faces of the package. The concave portions can be arranged at positions where the leads are bent approximately perpendicularly along the side faces of the package at respective central portions of the leads. Thus, a cross-sectional area of a bending portion of the lead can be reduced, thereby enabling the lead (or leads) to be easily bent with a smaller bending load. Therefore, a surface mount semiconductor device can be achieved which prevents disconnection without impairing a heat radiation property and which has good moisture resistance.

Surface mount semiconductor device

It is an object of the present invention to provide a wavelength conversion LED which improves light emitting efficiency through the use of a simple configuration. A LED comprising electrode terminals, a LED chip, a reflector having a bowl reflecting the light emitted from the LED chip to an opening, a enclosing resin filled into the bowl, and a wavelength conversion material mixed into the enclosing resin, absorbing the light emitted from the LED chip, and emitting light with a longer wavelength than that of the absorbed light is characterized in that the LED chip is connected to a electrode terminal inside the bowl, and in addition, a conductive reflective member for reflecting the light emitted from the junction surface without transparency thereof on the substantially whole surface is provided at the top surface of the LED chip, the density of the wavelength conversion material mixed into the enclosing resin is larger at the bottom of the junction surface of the LED chip than at the top thereof; and/or a wavelength conversion material layer is formed into a prescribed shape on the inside surface of the reflector with the bowl.

Light emitting diode

Growing community of inventors

Tokyo, Japan

Hayato Oba