Jsr Corporation

International Business Machines Corporation

Hayato Namai

Norihiko Ikeda

Goji Wakamatsu

Daniel Sanders

Joy Cheng

Takanori Kawakami

Katsuaki Nishikori

Ratnam Sooriyakumaran

Koichi Hasegawa

Charles Thomas Rettner

Ken Maruyama

Takehiko Naruoka

Hiroki Nakagawa

Masafumi Hori

Shinya Minegishi

Hitoshi Osaki

Kazuo Nakahara

Naoya Nosaka

Kentaro Harada

Tsubasa Abe

Yuushi Matsumura

Kyoyu Yasuda

Hiromu Miyata

Kazunori Sakai

Satoshi Dei

Takuhiro Taniguchi

Kazuya Kiriyama

Kota Nishino

Syun Aoki

A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R, R, and Reach independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X, X, and Xeach independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; Rrepresents a hydrocarbon group having 1 to 20 carbon atoms and Rrepresents a hydrocarbon group having 1 to 20 carbon atoms, or Rand Rtaken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which Rand Rbond; n is 0 or 1; Arepresents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R)CO—.

Radiation-sensitive resin composition, method of forming resist pattern, and compound

A composition for resist underlayer film formation, includes a first compound and a solvent. The first compound includes a first group represented by formula (1) and a partial structure comprising an aromatic ring. In the formula (1), Rrepresents a single bond or an oxygen atom, Rrepresents a divalent chain or alicyclic hydrocarbon group having 1 to 30 carbon atoms, and * denotes a bonding site to a moiety other than the first group of the first compound.*&#x2014;R&#x2014;R&#x2014;CN&#x2003;&#x2003;(1)

Composition for resist underlayer film formation, resist underlayer film and method for producing patterned substrate

A radiation-sensitive resin composition includes a first compound represented by formula (1), a first polymer comprising an acid-labile group, and a radiation-sensitive acid generator other than the first compound. The radiation-sensitive acid generator includes an onium salt compound. In the formula (1), n is 2 or 3; m is 1 or 2; Yrepresents a monovalent radiation-sensitive onium cation; and L represents a single bond or an organic group having a valency of n. L includes linking moieties each linking two of the carboxylate groups in formula (1). Number of atom(s) included in a linking moiety having a minimum number of bonds among the linking moieties is 0 to 10. In a case where L represents a single bond, n is 2, and in a case where n is 2, m is 1. 

Radiation-sensitive resin composition and resist pattern-forming method

A resin composition comprises a polymer comprising a structural unit that comprises a group represented by formula (1), and a solvent. In the formula (1), Rto Reach independently represent a hydrogen atom, a fluorine atom or a monovalent organic group having 1 to 20 carbon atoms, wherein at least one of Rto Rhas the fluorine atom or a group including the fluorine atom. Rrepresents a substituted or unsubstituted trivalent chain hydrocarbon group having 1 to 7 carbon atoms. * denotes a binding site to other moiety of the structural unit. The structural unit is preferably represented by any one of formulae (2-1) to (2-3). In the formulae (2-1) to (2-3), Z represents a group represented by formula (1). 

Resin composition, resist pattern-forming method and polymer

An acid diffusion control agent includes a compound represented by a formula (1), a compound represented by a formula (2) or both thereof. Rrepresents a hydrocarbon group comprising a monovalent alicyclic structure, or the like. Rand Reach independently represent a monovalent hydrocarbon group, or the like. Rand Reach independently represent a monovalent hydrocarbon group, or the like. Rand Reach independently represent a monovalent hydrocarbon group, or the like. Rrepresents a monocyclic heterocyclic group together with the ester group and with the carbon atom. n is an integer of 1 to 6. Rrepresents a monovalent hydrocarbon group, or the like. Rrepresents a monovalent hydrocarbon group having 1 to 10 carbon atoms. Rand Reach independently represent a monovalent hydrocarbon group, or the like. Rand Reach independently represent a monovalent hydrocarbon group, or the like. 

Acid diffusion control agent, radiation-sensitive resin composition, resist pattern-forming method, compound, and production method

A radiation-sensitive resin composition comprises: a polymer, and a radiation-sensitive acid generator. The polymer comprises a structural unit comprising: an acid-labile group; and an oxoacid group or phenolic hydroxyl group protected by the acid-labile group. The acid-labile group is represented by formula (1). Rand Reach independently represent a divalent organic group having 1 to 20 carbon atoms. Rrepresents a monovalent group having 1 to 40 atoms and having at least one selected from the group consisting of an oxygen atom, a sulfur atom and a nitrogen atom. * denotes a binding site to the oxy group in the oxoacid group or phenolic hydroxyl group protected. 

The present invention relates to a radiation-sensitive resin composition that contains: a compound that has a structure represented by the following formula (1); a first polymer that includes a fluorine atom; and a solvent. In the following formula (1), X represents a carbonyl group, a sulfonyl group or a single bond. Yrepresents a monovalent radiation-degradable onium cation. The first polymer preferably has at least one selected from the group consisting of a structural unit represented by the following formula (2a) and a structural unit represented by the following formula (2b). The first polymer preferably includes an alkali-labile group. The first polymer preferably includes an acid-labile group. It is preferred that a radiation-sensitive acid generator is further contained. 

A photoresist composition containing (A) a polymer having a structural unit (I) that includes an acid-labile group, and (I) a compound represented by the following formula (1). In the following formula (1), R, R, Rand R represent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms. X represents a single bond, an oxygen atom or &#x2014;NR&#x2014;. Rrepresents a hydrogen atom, a hydroxy group or a monovalent organic group having 1 to 20 carbon atoms, and optionally taken together represents a ring structure by binding with R each other. Arepresents &#x2014;SOor &#x2014;CO. Mrepresents a monovalent onium cation. 

Photoresist composition, compound, and production method thereof

A radiation-sensitive resin composition contains: a polymer having a structural unit that includes a group represented by formula (1); a radiation-sensitive acid generator; and an organic solvent. In the formula (1), Rrepresents a hydrogen atom or a monovalent organic group, and * denotes a binding site to a rest of the structural unit other than the group represented by the formula (1). It is preferred that Rin the formula (1) represents a monovalent organic group, and the monovalent organic group is an acid-nonlabile group. It is also preferred that Rin the formula (1) represents a monovalent organic group, and the monovalent organic group is an acid-labile group. 

Radiation-sensitive resin composition, resist pattern-forming method, polymer, and method for producing compound

A resist pattern-forming method includes forming a resist film using a photoresist composition. The resist film is exposed. The exposed resist film is developed. The photoresist composition includes an acid generator and a polymer. The acid generator generates a protonic acid upon application of exposure light. The protonic acid generates a proton. The polymer includes a first structural unit which includes a first group. The first group and the proton form a cationic group. The polymer substantially does not include a structural unit which includes an acid-labile group.

Resist pattern-forming method and photoresist composition

A photoresist composition containing: a polymer including an acid-labile group; a radiation-sensitive acid generator; and an acid diffusion control agent that contains a compound represented by a formula (1). In the formula (1), R, Rand Reach independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. A represents a group having a valency of n that is obtained by combining: a hydrogen atom, a linear hydrocarbon group having 1 to 30 carbon atoms, an alicyclic hydrocarbon group having 3 to 30 carbon atoms or a combination thereof; &#x2014;O&#x2014;, &#x2014;CO&#x2014;, &#x2014;COO&#x2014;, &#x2014;SOO&#x2014;, &#x2014;NRSO&#x2014;, &#x2014;NRSOO&#x2014;, &#x2014;NRCO&#x2014; or a combination thereof; and n nitrogen atoms as a binding site to the carbonyl group in the formula (1), in which a sum of atomic masses of the atoms constituting A is no less than 120. n is an integer of 1 to 4. 

Photoresist composition, resist pattern-forming method, acid diffusion control agent, and compound

A radiation-sensitive resin composition includes a polymer including a structural unit that includes an acid-labile group; and a compound represented by formula (1). Rrepresents a monovalent organic group having 1 to 30 carbon atoms. L represents a single bond, an oxygen atom or a sulfur atom. Mrepresents a monovalent radioactive ray-labile onium cation. The monovalent organic group represented by Ris preferably a monovalent hydrocarbon group or a monovalent fluorinated hydrocarbon group, and L preferably represents a single bond. The monovalent organic group represented by Ris preferably a monovalent hydrocarbon group, a monovalent fluorinated hydrocarbon group, a monovalent aliphatic heterocyclic group or a monovalent fluorinated aliphatic heterocyclic group, and L preferably represents an oxygen atom or a sulfur atom. The monovalent radioactive ray-labile onium cation represented by Mis preferably represented by the formula (X). 

Radiation-sensitive resin composition, resist pattern-forming method, acid diffusion control agent, compound, and method for producing compound

A radiation-sensitive resin composition includes a polymer that includes a structural unit represented by a formula (1), and an acid generator. Ris a hydrogen atom, a fluorine atom, or the like. Ris a hydrogen atom or a monovalent hydrocarbon group. Ris a hydrogen atom, a monovalent chain hydrocarbon group, or the like. Ris a hydrogen atom, a monovalent chain hydrocarbon group, or the like. Ris a hydrogen atom, a monovalent chain hydrocarbon group, or the like. Ris a monovalent chain hydrocarbon group. Ris bonded to Rto form a first alicyclic structure, or Ris bonded to Rto form a second alicyclic structure. At least one hydrogen atom of R, R, or Ris optionally substituted with a fluorine atom. 

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Tokyo, Japan

Hayato Namai