Nof Corporation

Hayato Ishibashi

Masahiro Ishidoya

Yoshinori Nakane

Hiroki Mizutani

A method of molding which comprises preparing a molding material by compounding a filler and a curable composition, the filler being in an amount of 0 to 800 weight parts based on 100 weight parts of the curable composition and optionally aging the molding material at room temperature or by heating, followed by casting the molding material into a mold and curing the molding material under atmospheric pressure or higher, and articles molded by such method. The curable composition comprises: (A) a compound having in the molecule two or more specific blocked carboxyl groups, (B) a compound having in the molecule two or more reactive functional groups which can form chemical bonds with the blocked carboxyl groups, and (C) a catalytic component selected from the following: (a) a thermal latent acid catalyst which comprises a compound having a epoxy group, a specific compound having a sulfur atom and a Lewis acid; (b) a thermal latent acid catalyst which comprises a compound having at least one nitrogen atom, oxygen atom, phosphorus atom or sulfur atom, a compound having a halogen atom and a Lewis acid having at least one aluminum atom, zinc atom or tin atom; or a mixture which comprises (c) a metallic chelate compound and an organic silicon compound or a condensate thereof.

Methods of molding and molded articles made thereby

A thermal latent acid catalyst which comprises (i) a compound having an epoxy group, (ii) a compound having a sulfur atom of the following formula: R.sup.5 --S--R.sup.6, wherein R.sup.5 and R.sup.6 are the same or different from each other and are a hydrogen atom or an organic group of 1 to 40 carbon atoms, R.sup.5 and R.sup.6 optionally are bonded with each other to form a cyclic structure; and (iii) a Lewis acid of the following formula: (X.sup.1).sub.n1 --M.sup.1 --(R.sup.7).sub.n2, wherein M.sup.1 is a boron atom, an aluminium atom, a tin atom, a lead atom or a transition element, X.sup.1 is one or more halogen atoms, R.sup.7 is one or more organic groups of 1 to 40 carbon atoms, R.sup.7 optionally forms a chelate ring by coordinating to the M.sup.1 atom, n1 and n2 are each an integer of 0 through 6, and n1 plus n2 equals an integer of 1 to 6. The ratio of the epoxy group of the epoxy compound (i) to the M.sup.1 atom of the Lewis acid is 0.2 to 10 and the ratio of the sulfur atom of the compound (ii) to the M.sup.1 atom of the Lewis acid is 0.2 to 10.

Thermal latent acid catalyst

A curable composition comprising (A) a compound having in the molecule two or more specific blocked carboxyl groups: (B) a compound having in the molecule two or more reactive functional groups which can form chemical bonds with the blocked carboxyl groups, and (C) a catalytic component selected from the following: (a) a thermal latent acid catalyst which comprises a compound having a epoxy group, a specific compound having a sulfur atom and a specific Lewis acid; (b) a thermal latent acid catalyst which comprises a specific compound, having at least one of a nitrogen atom, an oxygen atom, a phosphorus atom or a sulfur atom, a specific compound having a halogen atom and a specific Lewis acid having at least one of an aluminum atom, a zinc atom or a tin atom; or a mixture which comprises (c) a metallic chelate compound and a specific organic silicon compound or a condensate thereof. A two component curable composition is prepared by mixing (I) a main material composition or a solution thereof comprising the compound (A) and the compound (B) or a self-crosslinkable compound (D), and (II) an acid catalyst or the solution comprising at least one of a Bronsted acid, a Lewis acid or a mixture of a metallic chelate compound and a compound having a silanol group. The curable composition provides cured products having excellent chemical properties and physical properties and having desirable weathering resistance, stain resistance and appearance.

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Yokohama, Japan

Hayato Ishibashi