Murata Manufacturing Co., Ltd.

Hayami Kudo

Akinori Hamada

Yoshimasa Yoshioka

Shinji Otani

Ryo Okura

Kenji Nishiyama

Shinji Yasuda

Norihiko Takada

Yoshinori Ueda

Atsushi Yamamoto

Yuichi Takamine

Masahiko Kawaguchi

Koshi Himeda

Akihiro Nakamura

Katsuhiro Ikada

Koichi Yamaguchi

Yasuhiro Nakata

Masaki Tsutsumi

Miho Kitamura

Atsushi Kadoi

An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 μm, the wire pitch of the spiral wires is equal to or smaller than 10 μm, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 μm.

Inductor component, package component, and switching regulator

An inductor component comprises an element body; first and second inductors in the body; first and second columnar wirings in the body with end surfaces exposed from a first principal surface of the body and electrically connected to the first inductor; third and fourth columnar wirings in the body with end surfaces exposed from the first principal surface and electrically connected to the second inductor; first through fourth external terminals contacting the end surfaces of the first through fourth columnar wirings, respectively; and an insulating film on the first principal surface covering a portion of the end surface of the first and third columnar wiring not contacting the first and third terminals, respectively. The first terminal is closer to the third terminal than the fourth terminal, and a shortest distance between the first and third terminals is longer than a shortest distance between the first and third columnar wirings.

Inductor component

An electronic component comprising a main body part including an insulating layer and a conductor layer laminated alternately. The insulating layer and the conductor layer are partially exposed on a side surface of the main body part in a direction orthogonal to a lamination direction. Also, the side surface of the main body part is provided with a metal film extending in the lamination direction to cover the insulating layer and the conductor layer exposed on the side surface.

Electronic component

An electronic component includes a main body made of an insulator, a circuit element positioned inside the main body, and outer electrodes. The outer electrodes are constituted of bottom surface electrodes and post-like electrodes. The post-like electrodes are extended from a bottom surface of the main body toward the interior of the main body. Further, the post-like electrodes are embedded in the main body, and parts of the post-like electrodes are exposed to side surfaces of the main body. Furthermore, the bottom surface electrodes are made of a resin containing metal powder.

An electronic component comprising an element body including opposite first and second end surfaces, and an upper surface connecting the first and second end surfaces; a circuit element embedded in the element body; a first lead-out electrode embedded on the first end surface side and electrically connected to the circuit element; a columnar electrode arranged separately from the first lead-out electrode in a first direction viewed in a direction orthogonal to the first end surface, and embedded in the element body with a portion exposed from the first end surface to the upper surface; and a first via conductor connecting the first lead-out and columnar electrodes. An exposure width of the first via conductor, on the first end surface along a second direction orthogonal to the first direction viewed in the direction orthogonal to the first end surface, is smaller than the exposure width of the columnar electrode.

Electronic component and manufacturing method thereof

An inductor component includes a composite body that includes a plurality of composite layers each including a composite material of an inorganic filler and a resin; and a plurality of spiral wires that each are stacked on the composite layer, the spiral wires each being covered with the other composite layer. The average particle diameter of the inorganic filler is equal to or smaller than 5 &#x3bc;m, the wire pitch of the spiral wires is equal to or smaller than 10 &#x3bc;m, and the interlayer pitch between adjacent spiral wires is equal to or smaller than 10 &#x3bc;m.

A coil component having a first surface and a second surface facing each other, including a coil conductor formed into a spiral shape, a magnetic resin body disposed on the first surface side of the coil conductor without being disposed on the second surface side of the coil conductor, a first external terminal and a second external terminal disposed on at least one surface on the first surface side of the magnetic resin body and electrically connected to the coil conductor, and at least one dummy terminal disposed on at least one surface on the first surface side of the magnetic resin body without being electrically connected to the coil conductor.

Coil component

An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil disposed on the inorganic dielectric layer and electrically connected to the lower electrode or the upper electrode.

An electronic component includes a composite body made of a composite material of a resin material and a metal powder; and a metal film disposed on an outer surface of the composite body. The metal film is in contact with the resin material and the metal powder of the composite body, and an average particle diameter of crystals of the metal film contacting the resin material is 60% or more and 120% or less of an average particle diameter of crystals of the metal film contacting the metal powder.

Electronic component and method of manufacturing electronic component

An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil electrically connected to the lower electrode or the upper electrode. The upper surface of the inorganic dielectric layer is flat.

A coil component has a first surface and a second surface facing each other. The coil component has a coil conductor formed into a spiral shape, an insulating resin layer covering the coil conductor, a magnetic resin layer disposed on the first surface side of the insulating resin layer without being disposed on the second surface side of the insulating resin layer, and an external terminal disposed at least on one surface on the first surface side of the magnetic resin layer and electrically connected to the coil conductor. The magnetic resin layer is made of a composite material of a resin and a metal magnetic powder. The external terminal includes a metal film contacting the resin and the metal magnetic powder of the magnetic resin layer.

An inductor component has a plurality of layers of spiral wirings a magnetic composite body directly or indirectly covering the plurality of layers of spiral wirings and made of a composite material of a resin and a metal magnetic powder with an average particle diameter of 5 &#x3bc;m or less an internal electrode embedded in the magnetic composite body with an end surface exposed from an outer surface of the magnetic composite body, the internal electrode being electrically connected to the spiral wirings, and an external terminal disposed on the outer surface of the magnetic composite body and electrically connected to the internal electrode.

There is provided a common mode choke coil in which a non-magnetic layer and a second magnetic layer stacked on a first magnetic layer and two facing conductive coils are included in the non-magnetic layer, the non-magnetic layer is formed of sintered glass ceramics, the conductive coils and are formed of a conductor containing copper, and at least one of the first magnetic layer and the second magnetic layer is formed of a sintered ferrite material containing FeO, MnO, NiO, ZnO and CuO. The sintered ferrite material has an FeO-reduced content of 25 to 47 mol % and a MnO-reduced content of 1 to 7.5 mol %, or FeO-reduced content of 35 to 45 mol % and a MnO-reduced content of 7.5 to 10 mol %, and a CuO reduced content of 5 mol %.

Common mode choke coil and method for manufacturing the same

An elastic wave device has a structure that prevents flux from flowing into a hollow space of the device during mounting of the device using solder bumps. The elastic wave device includes a substrate, a vibrating portion located on a first main surface of the substrate, pads located on the first main surface of the substrate and electrically connected to electrodes of the vibrating portion, a supporting layer arranged on the first main surface of the substrate so as to enclose the vibrating portion, a sheet-shaped cover layer composed of resin including synthetic rubber and disposed on the supporting layer so as to form a hollow space around the periphery of the vibrating portion, a protective layer composed of resin having resistance to flux and disposed on a side of the cover layer remote from the supporting layer, via conductors extending through the protective layer, the cover layer, and the supporting layer and connected to the pads, and external electrodes including solder bumps, disposed at ends of the via conductors adjacent to the protective layer.

Elastic wave device and method for manufacturing the same

A piezoelectric device includes a piezoelectric substrate, a conductive pattern which is provided on one main surface of the piezoelectric substrate and which includes an IDT electrode, a supporting layer which is arranged on the one main surface of the piezoelectric substrate so as to surround the periphery of an IDT-forming region in which the IDT electrode is provided and which has a thickness greater than that of the IDT electrode, and a cover layer which is arranged on the supporting layer and which covers the IDT-forming region. The supporting layer includes removed sections provided at a plurality of positions at least in a region close to the IDT-forming region, the removed sections being obtained by partially removing a portion of the supporting layer to be bonded to the one main surface of the piezoelectric substrate.

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Nagaokakyo, Japan

Hayami Kudo