Nanogen, Inc.

Havens R John

Jain Krotz

Thomas J Onofrey

Theodore M Winger

Smolko Dan

Dan Smolko

John J Scott

Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.

Platinum silicide permeation layer device with microlocaions

Microreaction molds and methods of molding very thin films onto substrate surfaces are provided. The molds and molding methods allow for consistency and uniformity in the thicknesses of the films that are applied to the substrate surfaces. The molds may be single composite, such as etched silica, or multicomposite, such as quartz/metal. The molds may further comprise an adjustable molding cavity. The molds of this invention are particularly applicable to generating thin polymeric films onto microchip substrates.

Methods for molding and grafting highly uniform polymer layers onto electronic microchips

Permeation layer attachment chemistry and method

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San Diego, CA, United States of America

Havens R John