Koninklijke Philips Corporation N.v.

Nxp B.v.

Hauke Pohlmann

Ronald Dekker

Theodorus Martinus Michielsen

Henricus Godefridus Rafael Maas

Wolfgang Schnitt

Andreas Gakis

Johann-Heinrich Fock

Joerg Mueller

Martin Schaefer

Martin Duemling

Michael Burnus

A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer () on a first side of a substrate (); providing a trench () in the material later (); etching material from the trench () such as to also etch the substrate () from the first side of the substrate (); grinding the substrate () from a second side of the substrate to expose the trench (); and using the exposed trench () as an etch hole. The exposed trench () is used as an etch hole for releasing a portion of the material layer (), for example a beam resonator (), from the substrate (). An input electrode (), an output electrode (), and a top electrode () are provided.

MEMS element

Flexible integrated monolithic circuit

Growing community of inventors

Hamburg, Germany

Hauke Pohlmann