Shin-etsu Chemical Co., Ltd.

Dainichiseika Color & Chemicals Mfg. Co., Ltd.

Shinshu University

Hatsuhiko Hattori

Yoshinori Yoneda

Shoji Ichinohe

Masaki Tanaka

Hiromasa Sato

Motoaki Umezu

Tomoya Kanai

Shota Iino

Atsushi Horinobu

Toshihisa Tanaka

Kensuke Kuwajima

Mikihisa Kondo

Since this laminated body having a silicone rubber and, at least in a section of a surface thereof, a layer of a cured product of a silicone-modified-polyimide resin composition that contains, for example, components (A), (Bc), and (C) possesses elasticity and allows wiring by means of a conductive paste thereon, such a laminated body is suitable as a base material of an electronic device. The component (A) is a silicone-modified polyimide resin in formula (1)Ee-Ff-Gg  (1){where E is represented by formula (2); F is represented by formula (3); G is a bivalent group derived from a diamine; f+e+g=100 mol %; the molar ratio f/(e+g) is 0.9 to 1.1; and e is 1-90 assuming that the sum of e and g is 100 (Ris a bivalent hydrocarbon group, Rand Rare alkyl groups, Rand Rare monovalent aliphatic hydrocarbon groups, Rand Rare aryl groups or the like, m is an integer of 0-20, n is an integer of 1-20, o is an integer of 0-20, and m+n+o is an integer of 1-30)-Im-X-Im-  (3)(Im is a cyclic group containing a cyclic imide structure, and X is selected from a single bond, O, and so forth)};

Silicone rubber-silicone modified polyimide resin laminated body

According to the present invention, a power module that has a base to which a power semiconductor device is bonded and a sealing body for sealing said base and in which the base and the sealing body are bonded with a primer layer interposed therebetween, said primer layer being formed of a cured product of a silicone-modified polyimide resin composition containing, for example, components (A) to (E) below, has high reliability because delamination of an epoxy sealing resin under high temperature conditions is suppressed. Ris a divalent hydrocarbon group, Rand Rare alkyl groups, Rand Rare monovalent aliphatic hydrocarbon groups, Rand Rare aryl groups or the like, m is an integer of 0-20, n is an integer of 1-20, o is an integer of 0-20, and m+n+o is an integer of 1-30.-Im-X-Im-&#x2003;&#x2003;(3)Im is a cyclic group including a cyclic imide structure, and X is a single bond or the like.

Power module comprising a primer layer

Disclosed herein is a fiber formed from a resin including a silicone-modified polyurethane resin comprising the reaction products of a polyol (A), a chain extender (B), an active-hydrogen-group-containing organopolysiloxane (C), and a polyisocyanate (D), wherein the active-hydrogen-group-containing organopolysiloxane (C) contains an active-hydrogen-group-containing organopolysiloxane (C-1) having a carbinol group at only one terminal.

Silicone-modified polyurethane fiber and method for manufacturing same

A solvent-free silicone-modified polyimide resin composition having fluidity and including no solvent, the composition containing (A) a silicone-modified polyimide resin of formula (1),Ee-Ff-Gg&#x2003;&#x2003;(1)(E is formula (2), F is formula (3), and G is a diamine-derived divalent residue; f+e+g=100 mol %, the molar ratio of f/(e+g) is 0.8-1.2) (Ris a divalent hydrocarbon group, R-Rare monovalent hydrocarbon groups, Rand Rare an alkyl group, aryl group, or aralkyl group; m, n, and o are 0-20, n+o&#x2265;1, m+n+o=1-60)-Im-X-Im-&#x2003;&#x2003;(3)(Im is a cyclic group including a cyclic imide structure, X is a single bond, oxygen, sulfur, sulfide group, sulfone group, carbonyl group, &#x2014;NR&#x2014;, &#x2014;CR&#x2014;, R&#x2014;, &#x2014;R(OR)&#x2014;, alkylene group, trivalent group having one H eliminated from said group, or arylene-alkylene group),(B) a polymerizable compound,(C) a polymerization initiator, and(D) hydrophobic fumed silica. This composition has excellent handleability due to its fluidity and thixotropy.

Solvent-free silicone-modified polyimide resin composition

Disclosed herein is a silicone-modified polyimide resin composition of solvent free type. The composition is suitable for use as an adhesive and a coating material which are capable of hardening upon irradiation with ultraviolet rays and/or visible rays. Also, it is saved from drooling even in the case of light filling with an inorganic compound and it is saved from bubble entrapment and nonuniformity at the time of application with heavy filling. It further exhibits good moldability due to its thixotropic properties. Moreover, it exhibits improved adhesion to polyolefin resins without impairing the past properties. Finally, it gives rise to a cured product which is not excessively hard, with a low elastic modulus, despite filling with an inorganic compound. The composition of the present invention includes components (A) to (B) listed below and is characterized by being fluid at 25&#xb0; C. and free of solvent:

Silicone-modified polyimide resin composition of solvent free type

A symmetric hyperbranched type silicone-modified polymerizable compound contains a compound represented by the following general formula (1). A hyperbranched type silicone-modified polymerizable compound has flexibility at the branched skeleton itself than the conventional ones, and reactivity of a polymerizable functional group is good and it is positionally and sterically symmetric, while it has a highly branched structure having siloxane chains.[(RR)CHOCH]CHORR&#x2003;&#x2003;(1)Rrepresents a monovalent linear, branched or cyclic siloxane chain; Rrepresents a divalent hydrocarbonylene methylene ether group represented by &#x2014;CHCRR(CRR)OCH&#x2014;, each of R, R, Rand Rmay be the same or different from each other and represents a hydrogen atom or a linear, branched or cyclic hydrocarbon group having 1 to 10 carbon atoms which may be bonded to each other, 'n1' represents an integer selected from 0 to 10; R, a divalent linking group; 'c', 0 or 1; and R, an unsaturated polymerizable functional group.

Symmetric hyperbranched type silicone-modified polymerizable compound, and its modularized preparation method

A purpose of the present invention is to provide a polymerizable group-containing silicone compound which is liquid at room temperature, has good handling properties and compatibility with other polymerizable monomers. The present invention provides a silicone compound represented by the general formula (1) which has a structure represented by the following formula (2) or (3):  

Silicone compound having a radical-polymerizable group and a method for the preparation thereof

The invention provides a symmetric hyperbranched silicone-modified polymerizable compound comprises a compound represented by the general formula (1). There can be provided a symmetric hyperbranched silicone-modified polymerizable compound having a structure with chemically high flexibility at the branched chain, having good reactivity of the polymerizable functional group, and having a branched structure which is positionally and sterically symmetric and pure than the conventional ones.(RR)CHORR&#x2003;&#x2003;(1)

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Annaka, Japan

Hatsuhiko Hattori