Sun Microsystems, Inc.

Hassan Siahpolo

Ronald L Barnes

James M Carney

Robert S Antonuccio

Robert J Lajara

Kenneth Kitlas

James F Testa

Joseph M Spano

Ehsan Ettehadieh

Jens U Horstmann

Mark Hong Chen

Mohsen Saneinejad

Eric R Eberhardt

Michael E Close

Daniel F Hoornaert

A mechanism for insertion of a circuit board into a rack assembly and extraction of a circuit board from the rack assembly. The mechanism may include a pair of levers coupled to a circuit board assembly. First and second members may be coupled to each of the levers. The first member may be positionable to engage an engaging formation on a rack for insertion of the circuit board into the rack assembly. The second member may be positionable to engage the engaging formation for extraction of the circuit board from the rack assembly.

Insertion and extraction mechanism for circuit boards

The present invention is a method and apparatus for unidirectional coolant flow control unit for pressurized cooling systems. The invention comprises a valve on a coolant flow control unit. The valve remains in the open position during normal function of the coolant flow control unit. If the coolant flow control unit fails, the valve closes. Thus, the cooling system performs better than prior art cooling systems in the event of a failure of one or more coolant flow control units. In one embodiment, multiple improved coolant flow control units can be implemented wherein a flow of coolant enters one side of the system and exits the other side. In the even of a failure, the closure of the valve is caused by the shifting pressure within the system, which forestalls the cooling problems associated with prior art redundant coolant control flow systems.

Method and apparatus for undirectional coolant flow control unit for pressurized cooling systems

A stiffener for a printed circuit board where the stiffener is placed between the printed circuit board and a wall of the metal chassis in a computer system housing. The loaded printed circuit board may first be mounted on the stiffener, which, in turn, may then be mounted on the appropriate wall of the chassis along with the circuit board. Alternately, the stiffener may first be mounted on the appropriate chassis wall, and the circuit board may then be mounted on the stiffener. Additional circuit components may then be added onto the circuit board. The lies between the circuit board and the wall of the chassis on which the circuit board is being mounted. The back plane support provided by the stiffener may reduce damage to the conducting paths of the printed circuit board due to pressures exerted during component mounting, manufacture, transportation, etc. Additionally, a circuit board carrying densely populated electronic components may be easily mounted on or removed from the chassis without damage. Adequate board-to-chassis grounding may also be accomplished through the sheet metal stiffener frame. Horizontal and vertical struts in the stiffener frame may provide additional stiffness and rigidity in the vicinity of the high density connectors on the circuit board. Besides increased stability, unusually tight tolerances on the flatness of the circuit board surface near high density connectors may be achieved with the support provided by the stiffener.

Computer system motherboard stiffener

An assembly for clamping a heat sink to an integrated circuit package that is mounted to printed circuit board. The assembly includes a pair of pin headers that are mounted to the printed circuit board. The assembly also contains a clip that is snapped onto the pin headers and presses the heat sink into the package. The pin headers each have a pair of posts that extend from a spacer. The posts are soldered to the printed circuit board to secure the headers to the board. The headers also have wire loops that extend from the spacers and capture the ends of the clip.

Mechanical heat sink attachment having two pin headers and a spring clip

A method and apparatus is disclosed for protecting a solder pad for a chip on tape packaged integrated circuit mounted on a surface of a printed circuit board that is exposed to a wave soldering operation. A pad cover may be used to protect the solder pad. The pad cover is mounted over the solder pad in a manner that protects the solder pad from being exposed to solder during the wave solder operation. After the wave solder is completed, the cover is removed and the leads of the chip on tape packaged integrated circuit are connected to associated solder pad traces on the printed circuit board. This type of arrangement is particularly useful in arrangements which require a heat sink to cool the chip on tape packaged integrated circuit.

Protecting cot packaged ICs during wave solder operations

The disclosed invention relates to a computer system, including a crib device and chassis and including a U-shaped actuator and handle with distinct cam surfaces for installing and removing a hard drive to and from the chassis of the system. The drive is securable to the crib device, which has a handle that allows the drive to be carried to and away from the chassis. The crib device and chassis have cams and cam engaging surfaces that cause the crib device and drive to move to effect engagement and disengagement of the electrical connectors of the computer system and drive.

Growing community of inventors

Campbell, CA, United States of America

Hassan Siahpolo