Applied Materials, Inc.

Patterson + Sheridan Llp

Harvey You

Manivannan Thothadri

Daniel Paul Forster

Neil Morrison

Arvinder M Chadha

Helinda Nominanda

Robert F Praino, Jr

Yan Ye

Tae Kyung Won

Dong-Kil Yim

Xuena Zhang

Wan-Yu Lin

Wenqing Dai

Yun-chu Tsai

Hsiao-Lin Yang

Jr Robert F Praino

Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a glass layer, an adhesion promotion layer on the glass layer, an anti-reflectance layer disposed on the adhesion promotion layer, a dry hardcoat layer having a nano-indentation hardness in a range from about 1 GPa to about 5 GPa and disposed on the anti-reflectance layer, and an anti-fingerprint coating layer disposed on the dry hardcoat layer.

Flexible multi-layered cover lens stacks for foldable displays

Flexible display devices, such as flexible cover lens films, are discussed and provided herein. The flexible cover lens film has good strength, elasticity, optical transmission, wear resistance, and thermostability. The cover lens film includes a hard coat layer with a thickness from about 5 μm to 40 μm, an impact absorption layer with a thickness from about 20 μm to 110 μm, and a substrate layer with a thickness from about 10 μm to 175 μm and is disposed between the hard coat layer and the impact absorption layer. By combining the hard coat layer and the impact resistant layer, the cover lens film is both flexible and strong with hardness from 6H to 9H.

Flexible cover lens films

Implementations described herein generally relate to flexible display devices, and more specifically to flexible cover lens films. The flexible cover lens film has improved strength, elasticity, optical transmission, and anti-abrasion properties. The flexible cover lens film comprises a multi-layer hardcoat disposed on a substrate layer. The substrate layer has a thickness between 2 μm to 100 μm, and the multi-layer hardcoat has a thickness between 1 μm to 10 μm. The multi-layer hardcoat comprises a first layer deposited using a wet deposition process, a second layer deposited using a dry deposition process, and one or more adhesion promotion layers. In terms of optical properties, the multi-layer hardcoat has a total transmission greater than 88%, a haze of about 1% or less, and a yellowness index of b*<1. By combining wet and dry deposition processes to form the multi-layer hardcoat, the cover lens film is both flexible and strong with hardness between 4 H and 9 H.

Multi-layer wet-dry hardcoats for flexible cover lens

Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a substrate, an anti-fingerprint coating layer, and an adhesion promotion layer disposed between the substrate and the anti-fingerprint coating layer.

Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a glass layer, an adhesion promotion layer disposed on the glass layer, a dry hardcoat layer having a nano-indentation hardness in a range from about 1 GPa to about 5 GPa and disposed on the adhesion promotion layer and an anti-fingerprint coating layer disposed on the dry hardcoat layer.

Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a glass layer, an impact absorption layer disposed on the glass layer, a moisture barrier layer disposed on the impact absorption layer, a substrate disposed on the moisture barrier layer, a wet hardcoat layer having a nano-indentation hardness in a range from about 0.4 GPa to about 1.5 GPa and disposed on the substrate, an adhesion promotion layer disposed on the wet hardcoat layer, an anti-reflectance layer disposed on the adhesion promotion layer, a dry hardcoat layer having a nano-indentation hardness in a range from about 1 GPa to about 5 GPa and disposed on the anti-reflectance layer, and an anti-fingerprint coating layer disposed on the dry hardcoat layer.

Flexible display devices, such as flexible cover lens films, are discussed and provided herein. The flexible cover lens film has good strength, elasticity, optical transmission, wear resistance, and thermostability. The cover lens film includes a hard coat layer with a thickness from about 5 &#x3bc;m to 40 &#x3bc;m, an impact absorption layer with a thickness from about 20 &#x3bc;m to 110 &#x3bc;m, and a substrate layer with a thickness from about 10 &#x3bc;m to 175 &#x3bc;m and is disposed between the hard coat layer and the impact absorption layer. By combining the hard coat layer and the impact resistant layer, the cover lens film is both flexible and strong with hardness from 6H to 9H.

Embodiments of the disclosure generally provide methods of forming a capacitor with high capacitance and low leakage as well as a good interface control for thin film transistor (TFT) applications. In one embodiment, a thin film transistor structure includes a capacitor formed in a thin film transistor device. The capacitor further includes a common electrode disposed on a substrate, a dielectric layer formed on the common electrode and a pixel electrode formed on the dielectric layer. An interface protection layer formed between the common electrode and the dielectric layer, or between the dielectric layer and the pixel electrode. A gate insulating layer fabricated by a high-k material may also be utilized in the thin film transistor structure.

Interface engineering for high capacitance capacitor for liquid crystal display

Embodiments disclosed herein generally relate to thin film transistors with one or more trenches to control the threshold voltage and off-current and methods of making the same. In one embodiment, a semiconductor device can include a substrate comprising a surface with a thin film transistor formed thereon, a first passivation layer formed over the thin film transistor, a trench formed within the first passivation layer and a second passivation layer formed over the first passivation layer and within the trench.

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Mountain View, CA, United States of America

Harvey You