Hewlett Packard Enterprise Development LP

Silicon Graphics International Corporation

Hewlett Packard Enterprise Patent Department

Harvey John Lunsman

John P Franz

Tahir Cader

Steven J Dean

Michael Scott

Ernesto Ferrer Medina

David Collins

Benjamin Kufahl

Robert Mascia

Russell Eric Stacy

Kevin B Leigh

John Robert Grady

Everett R Salinas

Brian T Purcell

Alan B Doerr

Matthew Richard Slaby

Ernesto Ferrer

Andy Warner

Roger Ramseier

Timothy Scott McCann

Bret M Cuda

Micheal D Scott

Troy Oxby

Michael Peterson

Michael Kubisiak

Mike Kubisiak

Mitchell Johnson

Brady Dulian

Jonathan Daniel Befort

Cooling module includes a mounting element, a force application member, a lever, and a cold plate movably coupled to the mounting element. The mounting element having engagement members, is coupled to a receptacle of an electronic device that is configured to receive a removable electronic device at the receptacle. The force application member having spring fingers, is disposed between the mounting element and the cold plate, and movable relative to the mounting element. The lever is connected to the mounting element and the force application member and shiftable between actuated and unactuated states. In the actuated state, the lever pushes the force application member along a first direction causing the engagement members to move the force application member along a second direction perpendicular to the first direction and urge the cold plate to compress the spring fingers and establish thermal contact between the cold plate and the removable electronic module.

Lever actuated cold plate

A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.

Conforming heat transport device for dual inline memory module cooling applications

Example implementations relate to a cooling assembly of a host circuit device, a circuit assembly including the host circuit device and a removable circuit device, and a method for thermal management of the removable circuit device removably connected to the host circuit device. The cooling assembly includes a cooling component and a thermal gap pad having an elastomer component movably connected to the cooling component and a plurality of beams embedded in the elastomer component. Each beam includes a first end portion, a second end portion, and a body portion extended between the first and second end portions. The first end portion of each of one or more beams is disposed in a first thermal contact with the cooling component and a second end portion of each of the one or more beams is disposed in a second thermal contact with a heat sink of the removable circuit device.

Elastomer embedded multipoint contact cooling

Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component includes an intermediate fluid channel. The body section is bifurcated into first and second body sections, and the first and second body sections are further merged into a third body section. The supply section is connected to the first and second body sections. The return section is connected to the third body section and the intermediate fluid channel via an inlet fluid-flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid-flow path established between the first and second cooling components.

Variable flow liquid-cooled cooling module

Example implementations relate to a cool fluid reservoir for managing loss of cool fluid in a coolant distribution unit (CDU). The cool fluid reservoir includes a cylinder which has an internal volume defined between an inlet and outlet, and a hollow piston that is slidably connected to the cylinder via one of the inlet or outlet to split the internal volume into a first volume portion filled with the cool fluid and a second volume portion filled with driver fluid. The first volume portion is fluidically connected to a closed fluid loop of the CDU via the hollow piston and other one of the inlet or outlet. The hollow piston is slidably driven by the driver fluid to reduce the first volume portion and inject a portion of the cool fluid from the first volume portion into the closed fluid loop based on an operating pressure of the cool fluid.

Cool fluid reservoir for a coolant distribution unit

A pair of fluid couplings for liquid cooling electronic devices comprises a first fluid coupling and second fluid coupling. The first fluid coupling comprises a female coupling interface and the second fluid coupling comprises a male coupling interface to couple with the female coupling interface. Each of the fluid couplings comprises a magnetic latch assembly coupled to the coupling interface thereof. Each magnetic latch assembly comprises a shell, magnets housed within the shell, and a group of ramp-and-hook latches coupled to the shell. The magnets cause the magnetic latch assemblies to magnetically attract one another during coupling, reducing the force a user may need to apply to complete the coupling. The ramp-and-hook latches of one magnetic latch assembly are complementary to the ramp-and-hook latches of the other magnetic latch assembly, and they are arranged to engage with one another and interlock when the first and second fluid couplings are coupled.

Fluid couplings with magnetic latch assembly

Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.

Receptacle with connectable spring finger for multipoint contact conduction cooling

A non-circular disconnect, comprising: a male body to insert into a non-circular female disconnect; a male poppet, wherein: when the non-circular disconnect is not inserted into the non-circular female disconnect, the male poppet is held in place, via spring force, at an opening of the non-circular male body to create a seal to prevent leakage; and when the non-circular disconnect is inserted into the non-circular female disconnect, the male poppet is pushed inwards, to allow for liquid to flow through the non-circular disconnect, by a plunger in the non-circular female disconnect.

Disconnects

A system chassis may comprise a frame having a width, depth, and height and a plurality of divider walls coupled to the frame and forming a plurality of receptacles each configured to receive an electronics tray containing an electronic assembly. Each of the plurality of divider walls comprises a metal sheet having a front edge, a back edge, and two lateral edges, the two lateral edges attached to two lateral walls of the frame. The front edge of the metal sheet has a concave shape such that a distance between the front edge and the back edge of the metal sheet continuously decreases while moving laterally from one lateral edge to a center of the front edge and continuously increases while moving laterally from the center to the opposite lateral edge.

System chassis with divider walls having a concave edge

Cooling module and a method of cooling an electronic circuit module using the cooling module

Example implementations relate to a pressure regulator assembly for a closed fluid loop of a CDU. The pressure regulator assembly has a cylinder having an internal volume, and first and second hollow pistons slidably connected to the cylinder to split the internal volume into a first volume portion having cooling fluid, a second volume portion having driver fluid, and a third volume portion having compressible matter. The first volume portion is fluidically connected to the closed fluid loop. The first hollow piston is reciprocated by the compressible matter to maintain operating pressure of the cooling fluid in the closed fluid loop. The second hollow piston is driven by the driver fluid in response to predefined pressure drop of the cooling fluid during predefined time period, to inject additional cooling fluid from the first volume portion into the closed fluid loop to restore pressure level of cooling fluid to operating pressure.

Pressure regulator assembly for a coolant distribution unit

A first electronic device may comprise a chassis and first fins. The chassis may be configured to removably couple with a second electronic device. The first fins are configured to interleave with second fins of the second electronic device in a coupled state of the first and second electronic devices. A corrugated thermal interface device comprises folded fins. The folded fins are coupled to the first fins and are also removably couplable to the second fins in the coupled state of the first and second electronic devices. Each folded fin comprises one or more lateral walls, and the corrugated thermal interface device further comprises a plurality of spring fingers coupled to and extending at least partially in a lateral direction from the lateral walls. The spring finger contacts may be contacted and displaced by the second fins in the coupled state of the first and second electronic devices.

Corrugated thermal interface device with lateral spring fingers

An electronic component enclosure includes a plurality of wall structures defining outer walls of the enclosure. Each wall structure has an internal fluid channel for circulation of cooling fluid. The enclosure further includes at least one partition structure disposed within the outer walls and having an internal fluid channel in sealed fluid communication with the internal fluid channel of at least one of the plurality of wall structures. The internal fluid channel of at least one of the plurality of wall structures and the internal fluid channel of the at least one partition structure defines a continuous fluid circulation path between a fluid inflow port and a fluid outflow port.

Photo-etched chassis cooling walls

A computing system includes an array of compute module racks, each compute module rack containing a plurality of compute modules and each compute module being accessible by extracting the compute module rack out of the array of compute module racks. A liquid distribution infrastructure comprising liquid coolant supply lines and return lines is arranged in a first plane adjacent to the array of compute module racks and coupled to each of the vertical racks to provide liquid cooling for the plurality of compute module racks. A power distribution infrastructure comprising power supply lines is arranged in a second plane adjacent to the array of compute module racks and coupled to each of the compute module racks. An optical interconnection infrastructure comprising optical fiber cables is arranged in a third plane adjacent to the array of compute module racks and coupled to each of the compute module racks.

Growing community of inventors

Chippewa Falls, WI, United States of America

Harvey John Lunsman