Westinghouse Electric Corporation

Harvey H White, Jr

Robert A Boenning

Harry Boler

Test data is incorporated within the microcode of a bit-slice microprocessor to be used during development of the program to verify program performance and during operation of the program as a built-in test. Little additional hardware is required and there is minimal impact on the structure of the program. The program is allowed to operate with the same data that it would have when integrated with the system. During development, the embedded data is used as a substitute for the rest of the system, allowing program development to continue until system integration, using only power supplies and some test equipment. When implemented and used with a commercially available microprocessor ROM emulator, the test data may be varied to highlight difficulties in algorithm design and program development. The operating program cannot tell the difference between live system data and embedded test data. Thus, the program will behave identically during development and system operation. This allows complete algorithm debugging during program development, and permits the rest of the system to be developed in parallel. Developmental test data can be used later for operational program/hardware bit confidence testing with minimal changes.

Bit-slice microprocessor test system

An apparatus for detecting excessive chafing of a cable arrangement against an electrically grounded structure includes a layer of semiconductive material positioned in surrounding relation with an elongated member such as an electrical cable, tube or hose. A layer of electrically insulating material surrounds the layer of semiconductive material. A detector circuit is electrically connected with a reference end portion of the semiconductive layer. The detector circuit is operable to detect at least momentary contact between the layer of semiconductive material and an electrically grounded structure due to erosion of the layer of electrically insulating material surrounding the semiconductive layer caused by excessive chafing of the layer of electrically insulating material against the ground structure. The detector circuit is further operable to provide an indication of the distance measured along the layer of semiconductive material between the reference end portion of the semiconductive layer and the location at which the layer of semiconductive material has at least momentarily contacted the electrically grounded structure.

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Hampstead, MD, United States of America

Harvey H White, Jr