Anelva Corporation

Canon Anelva Corporation

Other

Canon Anelva Technix Corporation

Haruzo Miyashita

Masayoshi Esashi

Yasuyuki Kitamura

A diaphragm-type pressure gauge which is attached to a vessel to be measured and measures a pressure by introducing a gas inside the vessel includes a housing into which the gas is introduced, and a sensor unit which is arranged in the housing, and includes a diaphragm electrode, a measurement surface of which is arranged parallel to an introduction direction of the gas. When the housing is attached to the vessel, the measurement surface of the diaphragm electrode is arranged parallel to a direction of gravitational force.

Diaphragm-type pressure gauge

A pressure gauge includes a first sensor for detecting a pressure in a first range, a second sensor for detecting a pressure in a second range, and a processing unit for determining a pressure value based on outputs from the first sensor and the second sensor. The first and the second ranges have an overlapping range, an upper limit of the second range is higher than that of the first range, the processing unit determines a correction value based on outputs from the first sensor and the second sensor when a pressure falls within the overlapping range, and the processing unit determines a pressure value based on an output from the second sensor and the correction value, when measuring, by using the second sensor, a pressure in the second range, higher than that of the first pressure range.

The present invention allows manufacturing of a capacitive diaphragm pressure gauge and a Pirani pressure gauge on a single silicon substrate, which makes it possible to reduce the manufacturing cost by the miniaturization of products and mass production. According to an embodiment of the present invention, the manufacturing method of a combined type pressure gauge is a manufacturing method of a combined type pressure gauge including a capacitive diaphragm pressure gauge and a Pirani pressure gauge, the method including a groove-forming step of forming a first groove portion and a second groove portion on a first surface side of a silicon substrate by etching, and a bonding step to bond a glass substrate to the silicon substrate so as to cover the first groove portion and the second groove portion on the first surface side of the silicon substrate.

Combined type pressure gauge, and manufacturing method of combined type pressure gauge

In an electrostatic capacitance diaphragm vacuum gauge, a diaphragm and a detection electrode opposing the diaphragm are arranged in a vacuum. The electrostatic capacitance diaphragm vacuum gauge measures pressure by measuring the change degree of an electrostatic capacitance between the diaphragm and detection electrode. The electrostatic capacitance diaphragm vacuum gauge includes atmospheric pressure variation factor detection units which detect atmospheric pressure variation factors as external factors that varies the pressure of the vacuum. The pressure of the vacuum is measured by subtracting information detected by the atmospheric pressure variation factor detection units.

Electrostatic capacitance diaphragm vacuum gauge and vacuum processing apparatus

A diaphragm pressure sensor includes a first insulating substrate, a conductive substrate with a diaphragm, and a second insulating substrate with a gas inlet are bonded so as to form a pressure reference room between the diaphragm and the first insulating substrate and a pressure measuring room between the diaphragm and the second insulating substrate. The deformation of the diaphragm caused by the pressure difference between the pressure measuring room and the pressure reference room is measured to obtain the pressure of a space which is communicated with the pressure measuring room through the gas inlet. Furthermore, a plate is adhered to a surface of at least one of the first and second insulating substrates and the plate has a lower thermal expansion rate in an ambient temperature than that of the insulating substrate to which the plate is adhered.

Diaphragm type pressure sensor

A capacitive pressure sensor and its manufacturing method can simplify the alignment and the bonding process in a vacuum, and stably carry out the bonding process. The capacitive pressure sensor includes an insulating, first substrate with a capacitance electrode, a second substrate which has a diaphragm electrode so as to separate a vacuum chamber and a pressure-measuring chamber on respective surfaces, and an insulating, third substrate with a gas inlet. The substrates are bonded in a manner that the capacitance electrode faces the diaphragm electrode and the pressure-measuring chamber leads to the gas inlet. In addition, a getter chamber is formed in the same surface of the second substrate as the pressure-measuring chamber, and the getter chamber is connected to the vacuum chamber.

Capacitive pressure sensor and its manufacturing method

A capacitive vacuum sensor includes an elastic diaphragm electrode and a rigid fixed electrode opposite the elastic diaphragm electrode. An internal space is defined between the elastic diaphragm electrode and the rigid fixed electrode. The elastic diaphragm electrode deflects elastically in response to any change in the pressure of a gas applied on the elastic diaphragm electrode, and the capacitive vacuum sensor is responsive to any change in the capacitance between the elastic diaphragm electrode and the rigid fixed electrode that may occur in accordance with the deflection of the elastic diaphragm electrode so that it can measure the pressure of the gas. The vacuum sensor can include an anticorrosive diaphragm electrode that can resist the corrosive action of the reactive gas when it is exposed to such gas, and can be fabricated by the micromachining technology.

Anticorrosive vacuum sensor

A pressure sensor includes a capacitive pressure sensor chip mounted with the intervention of a sealing member on a base adaptor so as to be detachable. The sensor chip being constructed in a manner that a second substrate with a diaphragm electrode is placed between a first substrate with a fixed electrode and a third substrate with a pressure inlet and is bonded to the first and the third substrate so as to overlap the fixed electrode, the diaphragm electrode and the pressure inlet with a prescribed gap between the fixed electrode and the diaphragm electrode. Moreover, the third substrate is larger than the second substrate to make place which extends outside the second substrate and plays a role as a sealing surface to be in contact with the sealing member, and the sealing surface is pressed to the base adaptor with the intervention of the sealing member.

Capacitive pressure sensor

A capacitive vacuum sensor includes a non-conducting substrate, a plurality of fixed electrodes on the non-conducting substrate, and a diaphragm electrode formed by a plurality of elastic structures, each of the elastic structures being arranged to oppose a respective one of the fixed electrodes and having a different physical size (area) that is the same as that of each corresponding fixed electrode. More specifically, the areas of the elastic structures have a specific relationship between them, as defined by a specific ratio, and the areas may differ successively from each other according to the specific ratio. The capacitive vacuum sensor further includes compensation electrodes that are not sensitive to any change in the capacitance that may occur in response to any change in the pressure, but is only sensitive to any change in the capacitance that may occur in response to any change in the temperature. The elastic structures forming the diaphragm electrode have a plurality of projections on the surfaces to detach the elastic structures, which have been pressed against by the corresponding fixed electrodes under the higher pressure, away from the corresponding fixed electrodes when the pressure becomes lower.

Capacitive vacuum sensor

A particle detecting system for detecting the number and size of particles generated in a process chamber of a semiconductor manufacturing system. The particle detecting system includes a small detection chamber and a particle detector. The small detection chamber not only has an internal space thereof provided outside a wall portion forming the process vacuum chamber so as to communicate with the process vacuum chamber, but also laser beam transmitting windows and scattered light extracting windows. The particle detector is arranged in an atmospheric environment outside the detection chamber and including a laser diode for emitting a laser beam into the detection chamber through the laser beam transmitting windows and photosensors for detecting scattered light generated within the detection chamber through the scattered light extracting windows. The detection chamber has such a structure as to be detachably attached to the process chamber. The particle detector is formed as a module, and can be attached to the detection chamber from outside the detection chamber. The particle detector has such a structure as to be detachably attached to the detection chamber.

Growing community of inventors

Fujiyoshida, Japan

Haruzo Miyashita