Olympus Corporation

Olympus Optical Company, Ltd.

Haruyuki Tsuji

Takahiro Komuro

Masayoshi Karasawa

Shunsuke Kurata

Toshihiko Tanaka

Katsuyuki Hashimoto

Yasutada Miura

Yasunori Ikeno

Masahiko Yazawa

Yasutoshi Kitahara

An inverted microscope that allows observation of a specimen from underneath includes an objective lens holding unit that holds an objective lens configured to collect at least observation light from the specimen, a tube lens configured to focus the observation light collected by the objective lens, a branching unit configured to branch an optical path of the observation light from the tube lens, and an observation image switching device that is removably provided in a microscope main body between the objective lens and the tube lens and is configured to switch between wavelengths of an observation image or between magnifications of the observation image.

Inverted microscope including a control unit configured to synchronize a switching operation between absorption filters with a switching operation between excitation filters

A visual inspection apparatus includes: a first substrate holding portion that holds a substrate so that a top surface is observable; a second substrate holding portion that holds the substrate so that a bottom surface is observable; a first substrate holding portion moving mechanism that moves the first substrate holding portion; a second substrate holding portion moving mechanism that moves the second substrate holding portion; and a control device that controls the first substrate holding portion moving mechanism and the second substrate holding portion moving mechanism so that the position of the substrate when observing the top surface of the substrate in the first substrate holding portion substantially matches the position of the substrate when observing the bottom surface of the substrate in the second substrate holding portion.

Visual inspection apparatus

A semiconductor wafer inspection apparatus is provided with a rotatable table on which a semiconductor wafer is held by suction, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.

Semiconductor wafer inspection apparatus

A defect detecting apparatus comprising an illuminating unit which irradiates an object with illumination an image sensing unit which senses an image of the object an angle controller which controls an inclination angle of at least one of the illuminating unit and the image sensing unit, an image processor which senses images of the object while the angle controller changes the inclination angle of at least one of the illuminating unit and the image sensing unit and obtains a relationship between each inclination angle and optical information corresponding to the each inclination angle, and a determination unit which determines an image sensing condition suited to observation in accordance with the relationship wherein the angle controller sets the inclination angle of the illuminating unit or the image sensing unit on the basis of a determination result from the determination unit such that the inclination angle matches the image sensing condition.

Defect detecting apparatus

Growing community of inventors

Ina, Japan

Haruyuki Tsuji