Eudyna Devices Inc.

Fujitsu Quantum Devices Limited

Haruyoshi Ono

Isao Baba

Hidemitsu Sugawara

A testing system including a plurality of test applying portions that operate a test device for outputting an output signal; a plurality of testing portions that test the output signal of the test device; and a switch portion that switches the output signal between the test applying portions and the testing portions. The testing portions each have a test information portion that outputs test item information which includes a test capability of the testing portion, and have a test performing portion which is selected under the test item information that receives the output signal from the test applying portion through the switch portion, and performs a test under a designated test item.

Testing system, testing system control method, and test apparatus

A laser module includes a semiconductor laser, an output optical system provided on an optical output side of the semiconductor laser, a temperature detecting element that detects a temperature of the output optical system; and an output controller that calculates a drive current to set an optical output intensity of the laser module at a desired value on the basis of temperature information obtained by the temperature detecting element, and outputs the drive current to the semiconductor laser.

Laser module, control method of the same, control data of the same, and control data generation method

A testing system includes a plurality of test applying portions and a plurality of testing portions, each test applying portion having a test device that generates an output signal and each testing portion tests the output signal of the test device, in response to the test applying portion. The testing system further includes a switch portion that switches the output signal of the test device between the test applying portions and the testing portions. The test applying portion has a selecting portion that selects the testing portion through the switch portion for testing the output signal according to test item information, the test item information including information about a test capability of the testing portion.

A testing system includes a plurality of test applying portions and a plurality of testing portions, each test applying portion having a test device that generates an output signal and each testing portion tests the output signal of the test device, in response to the test applying portion. The testing system further includes a switch portion that switches the output signal of the test device between the test applying portions and the testing portions. The switch portion includes, a first switch having an input port and a plurality of output ports, which selects the output port for connecting the input port, a second switch having a plurality of input ports and an output port, which selects the input port for connecting the output port, and a connecting portion that has a plurality of transmission parts that connect the output ports of the first switch and the input ports of the second switch.

Testing system and testing system control method

An optical axis adjusting method for adjusting a tilt angle of an optical axis in two regions optically coupled in a holding member includes the steps of: roughly adjusting the optical axis by irradiating a first region on the holding member with a laser beam; and finely adjusting the optical axis by irradiating a second region on the holding member with a laser beam. One of the two regions is set as a reference point. The first region is located closer to the reference point, while the second region is located further from the reference point.

Optical axis adjusting method, optical module producing method, optical axis adjusting apparatus, and optical module

A wavelength measuring device includes: a light receiving element that receive light to be measured; a temperature controller that maintains the light receiving element at different temperatures; and a calculation unit that determines the wavelength of the light to be measured, based on the outputs of the light receiving elements.

Wavelength measuring device for a single light receiving element and wavelength measuring method at different temperatures

In the semiconductor laser module testing device, a temperature control power source changes a temperature of a wavelength locker module, and a wavelength monitoring bias circuit detects an output of a wavelength monitor in the changed temperature range and computes a correlation between a temperature of a semiconductor laser and a wavelength of light output therefrom. Moreover, the wavelength of the output light is locked by controlling the temperature of the wavelength locker module while feeding back the output of the wavelength monitor by a wavelength feedback circuit based on the obtained correlation between the temperature and the wavelength.

Device for and method of testing semiconductor laser module

In order to tune an oscillation wavelength of a semiconductor laser diode to a target wavelength, the amount of change of a wavelength to the amount of change of a wavelength varying item is determined by actual measurement and a basic wavelength coefficient is renewed by using the ratio of both amounts of change as a corrective wavelength coefficient, and thus the characteristic when the wavelength of an actual device is made closer to a target wavelength is utilized.

Wavelength inspection method of a semiconductor laser diode and a wavelength inspection unit thereof

A device and method for controlling the temperature of a semiconductor module in which the semiconductor module is sandwiched by a first supporting unit and a second supporting unit. An area of the second supporting unit with which the semiconductor module comes into contact is shielded from heat of external ambient atmosphere, and has a temperature sensor provided thereat. The temperature of the first supporting unit is controlled so that the temperature of this area becomes equal to a predetermined temperature. The amount of heat moving from the heat-shielded area to the semiconductor module is small, so that the difference between the temperatures in the region extending from the heat-shielded area and the semiconductor module is small. The first and second supporting units may be separately controlled at different predetermined temperatures. By this, changes in the temperature of the semiconductor module caused by changes in outside air temperature are reduced. The invention aims at making the difference between the temperature of the semiconductor module and a predetermined temperature small when controlling the temperature of the semiconductor module by bringing it into contact with the supporting units whose temperatures have been controlled.

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Yamanashi, Japan

Haruyoshi Ono